TSV Module Engineer

Hillsboro, OR 97123
  • Job Code
Job Description

TSV Module engineers within Intel's Logic Technology Development (LTD) organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century. We develop leading edge fabrication processes and continue to overcome seemingly impossible barriers to build best-in-class computing devices. The TSV Module Engineer's role encompasses ownership of critical processes and equipment that enable rapid miniaturization and the mass production of integrated circuits.

Duties of engineers in this role include: Designing, executing, and analyzing experiments necessary to meet engineering goals for the technology. Sustaining duties will include tool ownership and delivering a robust, manufacturable process module. In addition, participation in the development of intellectual property and development, in collaboration with the equipment vendors, of process hardware will be necessary. Overseeing the process in a manufacturing line which integrates the many individual steps necessary for the manufacture of complex microprocessors. This includes growing in-situ ramp to manufacturing volumes to demonstrate the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing sites across the globe.

The candidate must exhibit the following
behavioral traits:

  • Demonstrated experience with analysis and resolution of complex technical issues
  • Self-direct and show initiative
  • Good communication skills and the demonstrated ability to summarize complex data
  • Constructively contribute and mutually support our inclusive and diverse team of engineers and technicians.


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • The candidate must possess a Ph.D. degree in Physics, Material Science, Chemistry, Chemical Engineering, Physical Chemistry, Electrical Engineering, Mechanical Engineering, or a related field.

    Preferred Qualifications:
  • Sustaining duties including equipment ownership and delivering a robust, manufacturable module
  • Hands on experience using and maintaining scientific equipment
  • Semiconductor processing
  • Research experience on semiconductor fabrication (e.g. lithography, etch, film deposition, cleans, chemical-mechanical planarization, etc.)
  • Experience in statistical data analysis

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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TSV Module Engineer

Hillsboro, OR 97123

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