TSV Module Engineer

Intel
Hillsboro, OR 97123
  • Job Code
    JR0179167
Job Description

Join Intel-and build a better tomorrow. Intel is during an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. So, join us-and help us create the next generation of technologies that will shape the future for decades to come.

TSV Module engineers within Intel's Logic Technology Development (LTD) organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century. We develop leading edge fabrication processes and continue to overcome seemingly impossible barriers to build best-in-class computing devices. The TSV Module Engineer's role encompasses ownership of critical processes and equipment that enable rapid miniaturization and the mass production of integrated circuits.

Responsibilities, but not limited to:

  • Growing in-situ ramp to manufacturing volumes to demonstrate the technology meets requirements while simultaneously transferring the technology to counterparts in manufacturing sites across the globe.

  • Participate in the development of intellectual property and development, in collaboration with the equipment vendors, of process hardware will be necessary.

  • Overseeing the process in a manufacturing line which integrates the many individual steps necessary for the manufacture of complex microprocessors.

  • Designing, executing, and analyzing experiments necessary to meet engineering goals for the technology.

  • Sustaining duties will include tool ownership and delivering a robust, manufacturable process module.

Behavioral traits:

  • Ability to constructively contribute and mutually support our inclusive and diverse team of engineers and technicians.

  • Good communication skills and the demonstrated ability to summarize complex data.

  • Demonstrated experience with analysis and resolution of complex technical issues.

  • Ability to self-direct and show initiative.

What we offer:

  • We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth.

  • As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results.

  • We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation).

  • We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work!

We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. The experience listed below may be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.

Minimum Qualifications:

  • You must possess a Ph.D. degree or MS with 3 years of semiconductor experience majoring in Physics, Material Science, Chemistry, Chemical Engineering, Physical Chemistry, Electrical Engineering, Mechanical Engineering, or a related field.

Preferred Qualifications:

Experience with the following:

  • Research experience on semiconductor fabrication (e.g., lithography, etch, film deposition, cleans, chemical-mechanical planarization, etc.).

  • Sustaining duties including equipment ownership and delivering a robust, manufacturable module.

  • Hands on experience using and maintaining scientific equipment.

  • Semiconductor processing.

  • Statistical data analysis.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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TSV Module Engineer

Intel
Hillsboro, OR 97123

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