Thermals Principal Engineer

Intel
Hillsboro, OR 97123
  • Job Code
    JR0189552
Job Description

As part of the MSO organization, The Technology Development and Platform Integration Team enables differentiated hardware solutions in support of data-centric businesses. The team is comprised of Principal Engineers, Technologists and Commodity Managers who leverage the supplier ecosystem to identify technologies and hardware solutions that provide enhanced performance, reduced total cost, improved form factors, increased sustainability, and outstanding quality.

Looking for a thermals Leader and Principal Engineer to lead our effort to help differentiate the datacenters of the future through his deep knowledge of the supply base and ecosystem. As a Thermals PE, you will participate in IP creation, drafting of technical proposals, DOE execution, ecosystem analysis, and design/architecture optimizations in order to optimize for cost, performance, environmental impact, etc. You will be expected to be an active technical leader inside and outside the company. Activities include participation in major industry and academic conferences, voting membership in international standards committees, generation of patents and technical papers.


Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Bachelors degree in engineering (Mechanical, Chemical or related discipline) with more than 10 years work experience
  • 7 years experience in thermals server/PC system hardware engineering related to air and liquid cooling solutions

Preferred Qualifications:

  • Masters degree or PhD in mechanical/chemical engineering with more than 5 years of related work experience
  • 5 years experience in development/support of datacenter cooling solutions
  • 3 years experience in direct interfacing with suppliers and/or customers
     

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.



Other Locations

US, Arizona, Phoenix;US, California, Folsom;US, California, Santa Clara


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Position of Trust

This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter....

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Thermals Principal Engineer

Intel
Hillsboro, OR 97123

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