Thermal-Mechanical Test Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

This position is for a Semiconductor Test Research and Development Engineer within the Test Technology Development organization at Intel Corporation. This organization comprise of a group of innovative engineering heroes who work relentlessly to develop the best semiconductor test capability in the world, and we are currently looking for an engineering hero to join our team to play a key role in the definition and development of future Test Equipment Solutions - focusing on thermal technology solutions.

In this position, the candidate will assess capability across back-end Test modules to identify thermal-mechanical gaps, define suitable cost-effective solutions, and drive technology development activities accordingly.
As part of these efforts, the candidate will work closely with other technology Intel development teams, Test factories, as well as external suppliers to develop the new capability.

The ideal candidate is an innovative thinker who is able and comfortable thinking out-of-the-box when it comes to developing new technology ideas, yet has the ability to pay attention to engineering details when it comes to the hardware development, characterization, and implementation.

Candidate must exhibit the following behavioral traits/skills:

- Attention to detail.
- Think outside the box and devise novel solutions to complex, multi- discipline design problems.
- Work effectively in a collaborative environment.
- Communication skills with an ability to clearly convey technically complex material/recommendations within cross-functional design teams.
- Ability to inspire, motivate and influence team players.


You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum qualifications:

  • Candidate must possess a Masters degree with 3+ years of experience or PhD degree with 1+ years of experience in Mechanical Engineering with emphasis on Heat Transfer or Fluid Dynamics.

1+ years of experience in the following:

  • Deep understanding of the fundamental physics associated with heat transfer and fluid flow and the ability to apply this understanding to complex design problems.
  • Experience with numerical analysis (FEA).
  • Semiconductor cooling solutions, including heat sinks, heat pipes, vapor chambers, and water-channel cooling.
  • Statistical analysis software, such as Matlab, JMP, or similar tools.

Preferred qualifications:

1+ years of experience in the following:

  • Thermal testing to validate and improve thermal models and solutions.
  • Direct experience with ANSYS or ICEPAK or FLOWTHERM.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Thermal-Mechanical Test Engineer

Phoenix, AZ 85003

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