Substrates Equipment Development Principal Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0180777
Job Description

Substrate equipment sourcing (SES) organization is part of the assembly test supply chain group, contracts and sources tens of billions of dollars on behalf of Intel Corporation. The scope of the organization covers a wide range of capital equipment sourcing, manufacturing, and ecosystem development in support of manufacturing both direct,  indirect material including subcontract manufactured components. The organizations goal is to deliver Intels future through the worlds best, predictable, uninterrupted, cost-effective, and agile supply chain. The Substrate Equipment Sourcing (SES) group is commissioned to deliver differentiated (innovative, reliable, affordable, uninterrupted and capable) equipment supply chain, engineering, performance and services for Intel enabling current and future generation of advanced packaging substrates.

This person will be a Principal Engineer in the Substrate Equipment Sourcing (SES) group with in the Manufacturing, Supply Chain, and Operations (MSO) organization. This person will be working in partnership with-technologist, PE, area managers and senior engineers within MSO, TD, as well as extended ecosystem of equipment, component materials suppliers and substrate manufacturers- to develop next-generation equipment manufacturing technologies for high density interconnect substrate packaging.

Key responsibilities include, but are not limited to:

  • Play an influential and expansive role as a domain expert, in an individual contributor capacity, to lead the efforts and projects of defining key equipment platform specs and performance criteria to meet our next generation substrate manufacturing roadmap.
  • Be the key owner and developer of substrate equipment development and manufacturing roadmap in support of the substrate technology development roadmap owned and managed by the technology development partner organization.
  • Be the chief domain expert interfacing with and influencing an expansive ecosystem of equipment suppliers with a specific focus on the areas of; lithography, laser drilling, plating, advanced patterning technologies and related equipments.
  • Institute, manage and drive a comprehensive equipment platform development methodology in partnership with technology development, industrial engineering, program management and substrate business groups.
  • Identify key performance and selection indicators and work in partnership toward integrated suppliers and equipment selections with the ultimate objective of meeting schedule, output, affordability and roadmap requirements.
  • Expert in ecosystem development and value chain management toward ensuring selected solutions are high volume manufacturing (HVM) scalable.
  • Expert knowledge of capital equipment market, ecosystem dynamics with proven ability to create, maintain and influence effective relationships across a wide spectrum of global equipment suppliers.

A successful candidate should also exhibit the following  traits: 

  • Demonstrated technical and engineering depth, breadth, and leadership for driving, inventing, and developing scalable and capable equipment platforms and solutions.
  • Proven expertise in bringing industry-leading equipment technologies from concept to HVM deployment in a highly complex advanced technology environment
  • Expert in using advanced structural problem solving and model-based root cause analysis methodologies
  • Competency and proficiency with equipment development methodologies and experience providing leadership and driving internal stakeholders and equipment suppliers


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. 

Minimum Qualifications

Advanced degree (Masters-with 15 years of experience or PhD degree-with10+ years of experience) in one or more of the following engineering disciplines (Materials/Chemical/Electrical/Industrial and /or Mechanical) or 

equivalent educational qualifications in Physics, Chemistry or analytical sciences or other relevant and related disciplines are required

10+ years of semiconductor packaging or substrate technology development experience.
10+ years of semiconductor packaging or substrate equipment development experience.
10+ years of supplier management experience.  

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



Position of Trust

This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter....

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Substrates Equipment Development Principal Engineer

Intel
Phoenix, AZ 85003

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