Substrate Packaging Technology Development Manufacturing Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0196273
Job Description

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development, manufacturing, and yield improvement to packaging, final test and optimization, and world-class supply chain and facilities support. Employees in the Technology Development Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.

Become a part of Intel's Advanced Packaging Team by joining the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging.

The equipment engineering team drives equipment capability improvements and supports process development in SPTD's factory. In this position, you will be an owner of various auxiliary systems and equipment that support manufacturing. This job role requires a significant amount of time spent in and around the factory floor (not a remote position).

Responsibilities will include but are not be limited to:
- Ensuring the safety, quality, and performance of auxiliary and support equipment in the factory
- Developing equipment specifications and procedures for operation and maintenance.
- Driving compliance to regulations and industry standards.
- Developing engineering solutions to address the future needs of the factory.
- Training engineers and technicians in the safe operation and maintenance of equipment.

The ideal candidate should exhibit the following behavioral traits and skills:


- Treats the factory as a customer with a customer first approach: delivers safe, cost-effective, timely, and robust solutions while placing organizational goals over individual ones.
- Acts as an engineering role model: commits to quality, empowers others, is available as a resource, communicates transparently, builds networks, learns continuously, and fosters an environment of teamwork and inclusion.
- Tolerates ambiguity in a dynamic environment: prioritizes work, learns quickly, takes the initiative, and is flexible with work hours.
- Applies engineering fundamentals and sound judgment in disciplined problem solving: has a working knowledge of electrical schematics, piping and instrumentation diagrams (P and ID), commonly used measurement/diagnostic tools, and hand tools.

This is an entry-level position, and compensation will be given accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and experience would be obtained through a combination of school work, classes, research, or relevant previous job or internship experiences.


Minimum qualifications:


- Bachelor's degree with 3+ months of experience in mechanical engineering, electrical engineering, or a related field.


Candidate must have or expect the required degree by March 2022.

Preferred qualifications:


3+ months of experience in the following:


- Equipment maintenance and repair in an operational environment
- Project management

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Substrate Packaging Technology Development Manufacturing Engineer

Intel
Phoenix, AZ 85003

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