Sr. Process Engineer - MMIC Inspection

RTN 2 (Raytheon IDMS)
Andover, MA 01810
The Advanced Microelectronics Solutions (AMS) department at Raytheon Missiles and Defense (RMD) in Andover, MA is seeking a Work Center Leader to join our team within the area of Visual Inspection.

RMD is a technology and innovation leader. We produce a broad portfolio of advanced technologies including, missile defense systems, radars, precision weapons, and command and control systems, which directly contribute to protecting our nation and our war fighters. We value a diverse company with different perspectives and styles of tackling the worlds most complex challenges and toughest threats. Raytheon Technologies offers employee benefits such as a 9/80 work schedule with every other Friday off, 401(k) Savings & Investment Plans, Paid Time Off, Student Loan Repayment Plans, Educational Assistance, and Parental Leave.


AMS develops, designs, and manufactures compound semiconductor devices, millimeter/microwave integrated circuits, and modules for defense and commercial applications. As a member of the AMS Department, the individual in this role will serve as the lead for the Die Visual Work Center, which focuses primarily on inspection and pick-and-place operations in the back end of the line for semiconductor device manufacturing.

The ideal candidate will have experience in setting up jobs on automated optical inspection tools as well as pick and place tools, and demonstrate the ability to troubleshoot and correct tool errors in a manufacturing environment. The candidate will support the operational goals of the facility through forecasting of new product arrivals into the work center and appropriately scheduling engineering efforts to rapidly develop and validate inspection programs and pick and place programs. The candidate will also lead capital initiatives with regards to the selection and qualification of new tools within the work center.

The candidate should have a general background in various aspects of wafer fabrication including metal and dielectric deposition, etch, and photolithography. The role requires collaborative team work and continuous communication of the state of the work center to management. Demonstrated project management skills is desired


NOTE: This position can be either a Sr. Manufacturing Engineer I (G08) or Sr. Manufacturing Engineer II (G09) based on the candidates qualifications as they relate to the skills, experience and responsibility requirements for the position.

Required Education, Skill, and Experience:
  • Bachelors Degree, preferably in Engineering, Materials Science, Physics or Chemistry
  • Four or more years of related work experience
  • Experience with III-V compound semiconductor fabrication
  • Experience with automated inspection and pick-and-place tools
  • US Citizenship is required
U.S. Citizenship status is required as this position will need a U.S. Security Clearance within 1 year of start date.

Desired Education, Skills, and Experience:
  • MS degree in Engineering, Materials Science, Physics or Chemistry
  • Experience in automated inspection using Rudolf AIS systems
  • Experience with Royce pick tools
  • Experience in automated inspection to both commercial and military standards
  • Track record of success in a manufacturing environment
  • Skilled at multitasking, having attention to details, and working in collaborative team environments
  • Excellent communication skills
  • Ability to lead and coordinate technical projects with diverse and cross-functional teams
Security: Will require Department of Defense (DoD) Secret level security clearance; current clearance preferred.


This position requires the ability to obtain and hold a DoD secret security clearance.

This position requires the successful issuance, transfer or maintenance of any clearances and/or accesses necessary for the position. Non-US citizens may not be eligible to obtain a security clearance. The Defense Counterintelligence and Security Agency (DCSA), an agency of the Department of Defense, handles and adjudicates the security clearance process. Security clearance factors include, but are not limited to, allegiance to the US, foreign influence, foreign preference, criminal conduct, security violations and drug involvement. Additional detail regarding security clearance factors can be obtained by accessing the DSCA website at: https://www.dcsa.mil/mc/pv/fso/interim_clearances/


This position requires either a U.S. Person or a Non-U.S. Person who is eligible to obtain any required Export Authorization.

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Sr. Process Engineer - MMIC Inspection

RTN 2 (Raytheon IDMS)
Andover, MA 01810

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