Summary
Posted: Oct 27, 2020
Role Number:200201442
Do you love working on challenges that no one has solved yet? Do you like changing the game? Envision what you could do here. At A...Summary
Summary
Posted: Oct 27, 2020
Role Number:200201442
Do you love working on challenges that no one has solved yet? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish.
We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device's thermal performance and participate in advanced IC packaging research and development.
Key Qualifications
This position is responsible for:
Architecting thermal solutions to address chip energy efficiency and performance scaling
Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels,
Optimizing advanced IC design scheme/floor-planning to ensure good thermal performance
Developing detailed and reduced-order thermal models
Analyzing simulation and measurement results to enhance product thermal management
Education & Experience
MS or PhD in an Engineering Discipline, related field or experience in lieu of
Additional Requirements
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