Senior Thermal/Structural Simulation Engineer

Intel
Santa Clara, CA 95050
  • Job Code
    JR0177787
Job Description

Amazing experiences start with amazing opportunities in the dynamic field of silicon photonics. We are looking for an exceptional candidate to work in a fast-paced environment developing start of the art thermal and stress reduction solutions for next generation optical transceivers and contribute to Intel Silicon Photonics Product Division's mission to transform and lead Data Center optical connectivity and enable Intel's differentiation in the networking space.

As the module team thermal and structure engineer in our Silicon Photonics Research and Development organization, the individual will be responsible for developing and improving design practices, flows, and methods related to physical verification and simulation modeling.
 

The job responsibility includes:

  • Developing packaging design for state-of-the-art Silicon Photonics (SiPh) devices and assemblies.
  • Defining thermal design pathfinding activities aligned with product roadmap.
  • Provide design guidance through-out product development cycle by conducting thermal and stress simulation. Assess and mitigate risks associated with the design options.
  • Conduct detailed design simulation and validate/correlate simulation result thru data collection and measurement.
  • Identify new thermal management solutions and suppliers to improve product performance.


Additional Skills:

  • Excellent verbal and written communication, interpersonal skill.
  • Detail oriented problem solver, sense of urgency and commitment to achieve targeted goals.
  • Work independently with limited direction, as well as in a team environment across functional and organizational boundaries is required.
  • Work with multiple priorities and deliver against a schedule.

In this position you will gain invaluable experience which will allow growth and expanded opportunities within this business group as well as future possible opportunities with other business groups within Intel.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Education Requirement:

BS degree in Mechanical Engineering or related field and 4+ years of experience in product thermal design in semiconductor or optical transceiver industry.

Minimum Qualifications:

  • 2+ experience in ICEPAK and/or FLOTHERM modeling.
  • 1+ years of experience on thermal interface materials and thermal management solutions such as heat sinks, fans, heat pipe etc.
  • 1+ years of experience with product design simulation for stress and thermal.


Preferred Qualifications:

  • 1+ years of experience in packaging assembly process. Experience correctly defining the boundary conditions for the simulation problem.
  • 1+ years of experience in FEA structural analysis and knowledgeable on Abaqus or ANSYS modeling tools.
  • 1+ years of design experience in high volume product environment such as optical transceivers, cell phones, disk drives or automation.
  • 2+ years of experience in 3D design software such as Solidworks and enterprise data management system such as ePDM.
  • 1+ years of experience in transceiver module assembly processes.
  • 1+ years of experience in executing complex projects
  • 1+ years experience with dynamic analysis on opto-electronic devices, such as mechanical shock and vibration analysis, as well as testing and validation.

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intels transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologiesspanning software, processors, storage, I/O, and networking solutionsthat fuel cloud, communications, enterprise, and government data centers around the world.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Senior Thermal/Structural Simulation Engineer

Intel
Santa Clara, CA 95050

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