Senior Mechanical Packaging Design Engineer

Intel
Santa Clara, CA 95050
  • Job Code
    JR0180600
Job Description

Amazing experiences start with amazing opportunities in the dynamic field of silicon photonics. We are looking for an exceptional candidate to work in a fast-paced environment developing state-of-the-art mechanical and opto-mechanical design for next generation optical transceivers and contribute to Intel Silicon Photonics Product Division's mission to transform and lead Data Center optical connectivity, and enable Intel's differentiation in the networking space.

 

As the module team mechanical packaging engineer in our Silicon Photonics Research and Development organization, the individual will be responsible for developing and improving design practices, flows, and methods related to physical verification and simulation modeling.

 

Your responsibilities will include, but not limited to:

  • Developing packaging design for state of the art Silicon Photonics (SiPh) devices and assemblies.
  • Package designs and technology selection.
  • Assess and mitigate risks associated with the product designs.
  • Working with cross-functional groups to determine package requirements in order to meet electrical, optical, mechanical, thermal, and reliability requirements.
  • Identify new suppliers for design, develop and manage existing suppliers.
  • Define and conduct overall tolerance analysis for component and sub-assemblies.
  • Design assembly, test tooling and fixturing required for.
  • New Product Introduction and production transfer.
  • Interacting with suppliers and optimize designs based on supplier's processes and capabilities.
  • Generating all component drawings, layouts, assembly drawings for product and tooling.
  • Generating Bill of Materials (BOM).

The ideal candidate should exhibit the following behavioral skills:

  • Excellent verbal and written communication, interpersonal skill.
  • Detail oriented, problem solver, sense of urgency and commitment to achieve targeted goals.
  • Work independently with limited direction, as well as in a team environment across functional and organizational boundaries is required.
  • Team player with good communication skills.

In this position you will gain invaluable experience which will allow growth and expanded opportunities within this business group as well as future possible opportunities with other business groups within Intel.


Qualifications

You must possess the below education and minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Education Requirement:
Bachelors in Computer Science, Mechanical Engineering, or an equivalent degree in a related fields with 6+ years of experience in the semiconductor or related industry

Minimum Qualifications

  • 4+ years of experience in product design and development from initial conceptual design to high volume production.
  • 3+ years of experience in high volume manufacturing fabrication processes including machining, sheet metal stamping, metal /plastic injection molding and die casting.
  • 5+ years of experience in 3D design software such as Solidworks and enterprise data management system such as ePDM.
  • 3+ years of experience in working with product documentation, schematics, and Bill of Materials.


Preferred Qualifications

  • 3+ years of experience in designing assembly fixtures and tooling, preferably in the fiber optics or semiconductor environment.
  • 3+ years of design experience in high volume product environment such as optical transceivers, cell phones, disk drives or automation.
  • 2+ years of transceiver module assembly processes.
  • 1+ years of experience in the optical/photonics industry.
  • 2+ years of experience in product thermal design and heat sinks, fans, and thermal interface materials.
  • 1+ years of experience with design simulation for stress and thermal.
  • 1+ years of experience in in Computer Fluid Dynamics modeling tools such as ICEPAK, FLOTHERM, etc.
  • 2+ years of experience in Finite Element Analysis structural analysis and on Abaqus or ANSYS modeling tools.
  • 2+ years of proven experience in executing complex projects that require cross-functional teamwork is preferred.


 

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intels transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologiesspanning software, processors, storage, I/O, and networking solutionsthat fuel cloud, communications, enterprise, and government data centers around the world.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Senior Mechanical Packaging Design Engineer

Intel
Santa Clara, CA 95050

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