Semiconductor Packaging Engineer

SUNY Polytechnic Institute
Rochester, New York
  • Job Type
    Employee
  • Job Status
    Full Time

Semiconductor Packaging Engineer

 

Employment is with the Research Foundation for The State University of New York Polytechnic Institute (SUNY Poly)

 

The Research Foundation for The State University of New York (SUNY) is the largest, most comprehensive university-connected research foundation in the country. The Research Foundation manages SUNY's research portfolio, providing essential sponsored programs administration and innovation support services to SUNY faculty, students and staff performing research in areas including life sciences and medicine; engineering and nanotechnology; physical sciences and energy; social sciences; arts and humanities; and computer and information sciences.

 

The Research Foundation, a private, not-for-profit corporation, is an employer separate from both SUNY and the State of New York, and offers comparable compensation and benefit plans. The Research Foundation is dedicated to the goal of building a diverse and inclusive teaching, research, and working environment. Potential applicants who share this goal, especially underrepresented minorities, women, persons with disabilities, and veterans are strongly encouraged to apply.

 

Job Description:
This position is to be filled with an applicant that can collaborate with a cross-functional multi-diverse team supporting photonics and electronic integrated circuit technologies.

 

The position is for a back-end process / packaging engineer to join our packaging process engineering team to support manufacturing and development of semiconductor-based optics/optoelectronic components. This engineer will sustain the process and equipment of wafer back-end manufacturing processes, such as die singulation, pick & place and sorting, wire bonding, flip chip die bonding, underfills, encapsulation molding. micro-dispensing, optical alignment, polishing, hermetic packaging and final printed circuit board laminate assembly. Strong technical background in either optoelectronics or semiconductor device packaging with knowledge of Cu pillar and Pb free solder bumps industry experience is highly preferred.

 

This role assumes ownership of process flow and integration of all associated processes within the packaging process segment as well as with any WLP process interface and will be responsible for defining and developing package assembly process flow, material set, test vehicle, DOEs, process control plans to successfully develop and sustain reliable manufacturable products.

 

Other reasonable duties as assigned.

 

Requirements:
B.S. degree in Chemical Engineering, Materials Science, Electrical Engineering, or equivalent Engineering and/or Science discipline from a college or University accredited by the US Department of Education or internationally recognized accrediting organization AND 1-5 years of relevant professional industry experience.

 

Temporary assignment to work in Albany may be required 1- 3 months prior getting tools installed in Rochester.

 

PREFERRED QUALIFICATIONS:
M.S. degree in Chemical Engineering, Materials Science, Electrical Engineering, or equivalent Engineering and/or Science discipline from a college or University accredited by the US Department of Education or internationally recognized accrediting organization AND 1-5 years of relevant professional industry experience.

 

OR Ph.D in Chemical Engineering, Materials Science, Electrical Engineering, or equivalent Engineering and/or Science discipline from a college or University accredited by the US Department of Education or internationally recognized accrediting organization AND 1-3 years of relevant professional industry experience.

 

Applicants must address in their applications their abilities to work with a culturally diverse population. This position is contingent on the satisfactory completion of a background check; this position may require annual background checks.

 

Additional Information:
Research Foundation for SUNY Polytechnic Institute offers exceptional benefits such as healthcare, dental, vision, pension plans, competitive pay, generous paid time off, tuition assistance, life insurance and long-term disability insurance.

 

As an Equal Opportunity / Affirmative Action employer, Research Foundation for SUNY at SUNY Polytechnic Institute will not discriminate in its employment practices due to an applicant's race, creed, religion, color, citizenship, national origin, sex, age, sexual orientation, predisposing genetic characteristics, gender identification or expression, genetic information, familial status, marital status, pregnancy, status as a domestic violence victim, criminal conviction, disability, military status, disabled veteran, recently separated veteran, Armed Forces Service Medal veteran, active duty or wartime campaign badge veteran, or other characteristic as protected by law. Please feel free to review your equal employment opportunities protections and laws pertaining to these protections at http://www.dol.gov/ofccp/regs/compliance/posters/pdf/eeopost.pdf

 

The Jeanne Clery Disclosure of Campus Security Policy and Campus Crime Statistics Act, or Clery Act, mandates that all Title IV institutions, without exception, prepare, publish and distribute an Annual Security Report. This report consists of two basic parts: disclosure of the College's crime statistics for the past three years; and disclosures regarding the College's current campus security policies. The SUNY Polytechnic Institute Annual Security Report is available in portable document format [PDF] by clicking this link:

https://sunypoly.edu/sites/defult/files/CleryReport2019-Utica.pdf

https://sunypoly.edu/sites/default/files/CleryReport2019-Albany.pdf

 

Inquiries regarding the application of Title IX and other laws, regulations and policies prohibiting discrimination may be directed to the Title IX Coordinator TitleIX@sunypoly.edu at SUNY Polytechnic Institute. Inquiries may also be directed to the United States Department of Education's Office for Civil Rights, 32 Old Slip 26th Floor, New York, NY 10005-2500; Tel. (646) 428-3800; Email OCR.NewYork@ed.gov.

 

Pursuant to Executive Order 161, no State entity, as defined by the Executive Order, is permitted to ask, or mandate, in any form, that an applicant for employment provide his or her current compensation, or any prior compensation history, until such time as the applicant is extended a conditional offer of employment with compensation. If such information has been requested from you before such time, please contact the Governor's Office of Employee Relations at (518) 474-6988 or via email at info@goer.ny.gov.

 

Application Instructions:
Persons interested in the above position should submit a resume, three letters of reference, letter of application, along with The Research Foundation for SUNY employment application. In compliance with the Americans with Disabilities Act (ADA), if you have a disability and require a reasonable accommodation to apply for a position please email us at SUNYPOLYHR@sunypoly.edu or call 518-437-8686.

 

https://sunypoly.interviewexchange.com/jobofferdetails.jsp?JOBID=123263


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Semiconductor Packaging Engineer

SUNY Polytechnic Institute
Rochester, New York

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