Product - Module Packaging Engineer

Cupertino, CA
  • Job Code
    200001686

Summary

Work as Product / Module Packaging engineer supporting sensor hardware engineering projects

Key Qualifications

  • 5+ years experience working with module packaging, with diverse experience in areas such as MEMs, System in Package, Optical packaging, Camera Modules
  • Work closely with internal cross functional teams, Product Design, Test, Electrical Engineering, Mechanical Engineering, Reliability team
  • Key knowledge of assembly manufacturing processes and assembly flow
  • Deep level of tasks organization, work formalization and communication skills required
  • Ability to work on process, equipment, and material from development phase to mass production high volume manufacturing
  • Ability to work with international teams and travel

Description

Work as the key packaging / process engineer supporting complex, high volume semiconductor sensor modules
Provide leadership in the areas of module construction, materials, equipment, processes, reliability, and testing
Participate in the selection of vendors,
Work with vendors to develop MP intent equipment, process and materials
Provide leadership to a team of Asia based process engineers supporting the process development and qualification
Provide communication to senior management on issues as needed
Travel to vendor sites will be required

Education & Experience
Education & Experience

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Product - Module Packaging Engineer

Apple, Inc.
Cupertino, CA

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