Physical Debug Sample Prep Technical Lead

Intel
Hillsboro, OR 97123
  • Job Code
    JR0177927
  • Jobs Rated
    19th
Job Description

Responsible for leading the development of the new generation of die/package assembly and sample preparation technologies and development of the related equipment for Intel's Debug Labs through innovation and collaboration with internal and external developers and suppliers. This includes how to prepare samples or assembled products for FIB Circuit Edit, for Optical and electrical probing and for other new probing technologies.

Responsibility is also for the development of enabling technologies including TCB die attach and soldering on interposers. The role includes working with the Intel groups that develop assembly and manufacturing technologies as well as with the Intel product groups, identifying the requirements for sample preparation for future products, defining the technology and equipment roadmaps, directing a team of experts across different labs and geographies and with equipment vendors to develop the necessary technology and tools, partner with the Circuit Edit and Probe developers to provide the ability to modify circuits and probe signals on Intel's products.

Responsibility includes setting the strategy for successful sample preparation with high throughput and efficiency, strategy to quickly and efficiently adopt sample preparation methodologies to changing assembly methods. Development of sample preparation methods to deal with all new assembly technologies e.g. 3D assembly and developing characterization methods to track quality and assure high success rate of sample preparation.

The job requires the ability to handle multiple tasks, and demonstrate advanced engineering problem solving, team work and ability to work with minimum supervision and tactical direction.

In addition to the qualifications listed below, the ideal candidate will also have:

- Excellent technical writing skills
- Excellent teamwork, communications and interpersonal skills
- Willingness to work independently and tackle tasks under minimum supervision
- Excellent hand-eye coordination and hands-on skills


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

The candidate must possess a Bachelors degree in Mechanical Engineering, Electrical Engineering, Material Science, Physics, or a related field with 4+ years experience -OR- a Masters degree in Mechanical Engineering, Electrical Engineering, Material Science, Physics, or a related field with 3+ years experience -OR- a PhD in Mechanical Engineering, Electrical Engineering, Material Science, Physics, or a related field with 1+ years experience in the following:

- Engineering, troubleshooting and analytical skills
- Computer systems (Widows, UNIX, LINUX)

- Hands on lab experience

Preferred Qualifications:


- Thermal compressive bonding operation/recipe development
- Solder reflow, die attach, wire-bonding, Physical FA and other equipment and process
- Chemical and physical safety experience
- Coursework in CNC machining, CMP, FA, along with understanding of lasers, chemical and vacuum systems and their safety

- Presenting issues and solutions to technical and management forums

Inside this Business Group

The Design Engineering Group is a worldwide team responsible for the design, development, validation, and manufacturing of IPs and SOCs. Our mission is to deliver leadership products through groundbreaking innovations.



Other Locations

US, California, Folsom;US, California, Santa Clara



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Physical Debug Sample Prep Technical Lead

Intel
Hillsboro, OR 97123

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Physicist
19th2019 - Physicist
Overall Rating: 19/199
Median Salary: $117,220

Work Environment
Very Good
44/220
Stress
Low
78/220
Growth
Good
60/220