Packaging Thermal Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0176824
Job Description

Assembly and Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

  • Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.
  • Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
  • Conducts tests and research on basic materials and properties.
  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Provides consultation concerning packaging problems and improvements in the packaging process.
  • Responds to customer/client requests or events as they occur.
  • Develops solutions to problems utilizing formal education and judgment.

This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.


Minimum Qualifications

  • Possess a master's degree with 6+ months experience or PhD degree with 1+ years of experience in Mechanical Engineering or relevant field
  • Must have the required degree or expect the required degree by December 2021.


Preferred Qualifications

+6 months of experience (master's degree) or +1 years of experience (PhD) with one or more of the following:

  • Heat transfer and fluid dynamics
  • Application of heat transfer and fluid dynamics fundamentals to thesis or research work
  • Computational fluid dynamics (CFD) numerical techniques for thermal and fluid flow modeling such as finite volume/difference/element approaches in measurements expertise required in the thermal and/or fluid flow analysis.
  • Analysis tools like MATLAB/MathCAD.
  • Commercial software tools such as ANSYS FLUENT, FLOWTHERM, ICEPAK, COMSOL/Flow3D
  • CAD software such as Solidworks and PRO-E.
  • Thermal/fluid flow analysis of IC packaging.
  • Packaging assembly processes and failure analysis.
  • Design and high volume manufacturing.
  • Lab data collection tools like LabVIEW.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Thermal Engineer

Intel
Phoenix, AZ 85003

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