Packaging Research and Development Engineer - Wafer Assembly Technology Development

Intel
Hillsboro, OR 97123
  • Job Code
    JR0182111
Job Description

Wafer Assembly Technology Development (WATD) is a department within Assembly and Test Technology Development (ATTD) which Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

  • Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.
  • Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
  • Conducts tests and research on basic materials and properties.
  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Provides consultation concerning packaging problems and improvements in the packaging process.
  • Responds to customer/client requests or events as they occur.
  • Develops solutions to problems utilizing formal education and judgment.

This is an entry level position and will be compensated accordingly.


Qualifications

This position is not eligible for Intel immigration sponsorship if a candidate only has or will have a bachelor's degree.

You must possess the below minimum qualifications to be initially considered for this position.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • Possess a bachelor's degree with 3+ months of experience or master's degree with 6+ months of experience in Materials Engineering or Mechanical engineering or Chemical Engineering or Chemistry or Polymer Science or Engineering or related field.
  • Must have the required degree or expect the required degree by June, 2022.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer - Wafer Assembly Technology Development

Intel
Hillsboro, OR 97123

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