Packaging Research and Development Engineer SPTD Front End Litho Area

Phoenix, AZ 85003
  • Job Code
Job Description

Substrate Packaging Technology Development (SPTD) is looking to hire an engineer to join a team tasked with developing and ramping advanced organic substrate and packaging technologies via an internal pathfinding, technology development, and low volume manufacturing line. As a Packaging Research and Development Engineer in Module Engineering, you will be required to develop material characterization and process technology in the SPTD Front End Lithography Area. This position will require a significant amount of time spent on the factory floor to develop new process technology and characterization of new materials and chemical processes. Since this will involve startup of new manufacturing capability for Intel, a high tolerance of ambiguity and flexibility with respect to job roles is desired.

Candidate should exhibit the following:
- Wet process equipment.
- Solid theoretical and practical understanding in materials characterization.
- Listening, written and verbal communication skills.
- Problem solving and analytical skills.
- Capability of working and high performing team environment.

This is an entry level position and compensation will be given accordingly.


You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences .

Minimum Qualifications:

  • Candidate must possess a Masters degree with 6+ months of experience or PhD degree with 1+ years of experience in a relevant science or engineering field Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry.

Must have the required degree or expect the required degree by March 2022.

Preferred Qualifications:

1+ years of experience in the following:

  • Equipment development experience.
  • Experience in wet chemistry and lithography process development.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer SPTD Front End Litho Area

Phoenix, AZ 85003

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