Packaging Research and Development Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

Assembly and Test Technology Development (ATTD) Packaging R&D Engineers broadly provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies and various other electronic components/completed units.
The candidate will be responsible for :

  • Developing simulation methodologies for mechanics challenges/involved in the assembly and reliability of advanced packaging technology.
  • Optimize advanced packaging architectures for electronic products based on simulations and prototyping.
  • Design and develop prototypes, plan experiments, and collaborate with lab and assembly engineers to validate multiphysics simulation models.

The candidate should also exhibit the following behavioral traits/skills

  • Critical Thinking in failure analysis.
  • Deal with ambiguity, collaborate and work in a team setting and curiosity to learn.

This is an entry level position and compensation will be given accordingly.


You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • Possess a master's degree with 6+ months experience or PhD degree with 1+ years of experience in Mechanical Engineering, Material Science or related fields.
  • Candidate must possess the degree by employment start date

1+ years of experience with one or more of the following:

  • Constitutive behavior/failure modeling of metallic/ polymeric materials
  • Research at multiple material length scales : Continuum/Meso/atomistics
  • Commercial FE software (Abaqus/Ansys/COMSOL etc.)
  • Programming and scripting (Matlab, Python, Fortran etc.)
  • Solid Mechanics (Continuum Mechanics, Elasticity, Fatigue, Fracture etc.)
  • Metals and polymeric material behavior and failure mechanisms
  • Elastic, Inelastic and Fatigue behavior of metals/polymers
  • Root cause investigation, and DOE/FMEA creation
  • Experimental techniques in solid mechanics

Preferred Qualifications

6+ months of experience (master's) or 1+ year's of experience (PhD) in one or more of the following:

  • Ab-initio methods/Molecular Dynamics
  • Phase field methods or other interface tracking techniques
  • Grain recrystallization or polycrystal plasticity
  • Multiphysics modeling (Electro-mechanical/Thermo-mechanical/Fluid-structure)
  • Manufacturing process modeling

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer

Phoenix, AZ 85003

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