Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0199699
Job Description

Packaging RD Engineers provide project management, own Silicon Assembly design rule definition and are responsible for developing Assembly Test Chips used to certify new Intel processes.

Advanced Design Technology and Solutions within ATTD is looking for a Packaging R&D Engineer to join our exciting organization. In this role, you will have the opportunity to:

  • Provide project management and consultation concerning packaging problems and improvements in the packaging process
  • Own design rule definition for next generation packaging concepts & architectures
  • Define, Develop and coordinate Tapein of Assembly Test Chips to certify new Intel Processes.
  • Own definition and design of pathfinding Assembly Test chips used to understand chip-package interactions
  • Partner with stakeholders in the Fab or external foundry, to establish key risk areas for evaluation


Qualifications

You must possess the below requirements to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Possess a PhD in electrical, mechanical, material science or related field
  • Experience/Coursework in electronic packaging, assembly processes, chip package interaction
  • Coursework or familiarity with general EDA tools.
  • Coursework in Electronic Packaging or related engineering field

Preferred Qualifications:

  • Experience with Si design - with basic layout skills, and experience with Cadence Virtuoso or similar EDA platform

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.



Other Locations

US, Oregon, Hillsboro


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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