Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0195944
Job Description

Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components/completed units.

  • Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.
  • Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
  • Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Provides consultation concerning packaging problems and improvements in the packaging process.
  • Responds to customer/client requests or events as they occur.
  • Develops solutions to problems utilizing formal education and judgment.


Qualifications

 

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.


Minimum Qualifications

  • Possess a bachelors degree with 10+ years of experience or master's degree or PhD degree in Mechanical Engineering or Optical Engineering or Physics or Electrical Engineering or other applied engineering degree with 6+ months of experience


Preferred Qualifications

6+ months of work or educational experience in the following (having more than one will be preferred):

  • Lead project/program management
  • Accuracy, precision, repeatability and reproducibility principles
  • Geometrical dimensional and tolerancing
  • Stackup tolerance analysis, mechanical drawing, CAD software to read and design mechanical parts
  • Project management (Excel, Visio or other specific applications)
  • Programming (Python, Matlab and C++ for large data for specific applications)

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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