Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0196276
Job Description

Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components/completed units.

  • Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.
  • Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
  • Conducts tests and research on basic materials and properties.
  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Provides consultation concerning packaging problems and improvements in the packaging process.
  • Responds to customer/client requests or events as they occur.
  • Develops solutions to problems utilizing formal education and judgment.

This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • Possess a PhD degree in Metallurgy or Materials Engineering or Science or Polymer Science or Polymer Chemistry or Physics or Chemical Engineering or related field and 1+ year's of experience.
  • Must have the required degree or expect the required degree by August, 2022

Preferred Qualifications


1+ years of experience with one or more of the following:

  • Data analysis and statistical principles
  • General semiconductor packaging and assembly technologies
  • Communicating with suppliers and driving supplier technology development

Inside this Business Group

As an integral part of Intel's new IDM2.0 strategy, we establish Intel Foundry Services (IFS), a fully vertical, standalone foundry business, reporting directly to Intel's CEO. IFS will be a world-class foundry business and a major US and European-based capacity provider to serve customers globally. We differentiate IFS with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, plus a world-class IP portfolio including x86 cores, graphics, media, display, AI, interconnect, fabric, and other critical foundational IP, along with Arm and RISC-V ecosystem IPs. IFS will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions using industry-standard design packages. Intel dedicates IFS to the success of its customers with entire Profit and Loss responsibilities. This model will ensure that our foundry customers' products will receive our utmost focus in terms of service, technology enablement, and capacity commitments. IFS is already engaged with customers today, starting with our existing foundry offerings. We are expanding imminently to include our most advanced technologies optimized for cutting-edge performance, making them ideal for high-performance applications.


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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