Packaging Research and Development Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

Become a part of Intel's Advance Packaging Team by joining the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the SPTD organization to assist in achieving our mission and continuing to make this a great place to work.

Microelectronic Packaging Engineers in SPTD provide project management, advanced package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
Backend Litho Area is looking for a Packaging Research and Development Engineer to join the team tasked with developing and ramping advanced backend bump scaling technologies.

The candidate will be responsible for, but are not limited to:

- Thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification.
- New materials and technology development in backend lithography processes, including lamination, coating, exposure, cure, plasma etch and other wet processes.
- Process development and transfer supporting pathfinding and development of different technologies.
- Innovated model based problem solving through application of fundamental technical knowledge, experimental design and statistical methods.
- Build competency on new equipment/processes and develop emerging TD/PF technologies to effectively support growing roadmap.

The ideal candidates should exhibit the following behavioral traits/skills:

- Self-motivated with written and verbal communication skills.
- Model based problem solving and analytical skills.
- Flexibility in changing priorities and responsibilities to support business needs.
- Willingness to work independently and collaboratively.
- Demonstrate technical innovation and leadership. Deliver results for complex time critical technical projects.
- Apply fundamental science and engineering concepts in development to create novel solutions.
- Combine solid engineering judgement and data analysis to draw fundamental conclusions, build models and design experiments.

This is an entry level position and compensation will be given accordingly.


You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences .

Minimum qualifications:

- Candidate must possess a Ph.D. degree in Mechanical Engineering or Materials Science or Electrical Engineering or Physics/Applied Physics or related field.

Must have the required degree or expect the required degree by March 2022.

Preferred qualifications:

1+ years of experience in the following:

- Polymerization, deformation of materials, and material development. Experience in fracture and adhesion. mechanisms of materials and material interfaces.
- Fundamentals of materials science and engineering
- Analytical tools (such as SEM, FTIR, TMA, DMA, DSC, TGA, SIMS, and mechanical testing machines).
- Fundamental science and engineering concepts in technology development to create novel solutions including knowledge of Design of Experiments (DOE) and Statistical Process Control (SPC) principles
- Experience in data analytics, machine learning algorithm, Monte Carlo simulation, or optimization algorithm development.
- Mechanical design.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer

Phoenix, AZ 85003

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