Packaging Research and Development Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

Substrate Packaging Technology Development SPTD Microelectronic Packaging Research and Development Engineers enable substrate and packaging technologies for development of new materials equipment process flows and process improvements.

Responsibilities will include but are not be limited to:

-Innovation problem solving development and continuous improvement of equipment and processes through application of experimental design and statistical methods

-IC substrate process and equipment development including application of novel concepts in manufacturing technology solutions for next generation devices

-Process and equipment specification development application of principles for design of experiments and data analysis in addition to planning and documentation of improvements through the change control process

-The training of additional engineers and technicians to facilitate technology and process transfer to other factories worldwide for High Volume Manufacturing HVM.

The ideal candidate should exhibit the following behavioral traits and or skills:

-Written and verbal communication skills

-Problem solving analytical and troubleshooting abilities

-Flexibility in changing priorities and responsibilities to support business needs

-Tolerance for ambiguity in a fast paced constantly changing product roadmap environment

-Self initiated action oriented with the willingness to work independently

-Participation and a sense of ownership frequent floor presence and interaction with manufacturing personnel

-Demonstrate technical innovation and delivered results for complex time critical technical projects.

-Willingness to apply fundamental science and engineering concepts in development to create novel solutions.

This is an entry level position and compensation will be given accordingly.


You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences .

Minimum qualifications:

  • Candidate must possess a bachelor's degree (with 1+ years of relevant experience) or master's degree with 6+ months of experience in Mechanical Engineering or Materials Science Engineering or Chemical Engineering or Electrical Engineering or Physics or a related field.

Must have the required degree or expect the required degree by October 2021. 

Preferred qualifications:

3+ months of experience in the following:

  • Electrochemistry and/or vacuum deposition techniques.
  • Process and equipment development for applications in the Integrated Circuit (IC), packaging or Printed Circuit Board (PCB) industry.
  • Semiconductor and or IC substrate fabrication processes and technology.
  • Material structure property relations polymer and or metal and or composite material mechanical properties solid mechanics organic chemistry organic composites and polymer chemistry and or physics.
  • Optical microscopy electron microscopy SEM FIB TEM EBSD analytical techniques FTIR Raman TGA DSC Surface analysis XPS TOFSIMS EDS AFM XRD mechanical cross sections and other package level failure analysis techniques.
  • Statistical data analysis JMPJSL machine learning.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer

Phoenix, AZ 85003

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