Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0182766
Job Description

The Assembly and Test Technology Development (ATTD) Experimental Mechanics Lab deals with thermo-mechanical challenges in the development of advanced packaging technologies.

  • The personnel in this lab use a variety of tools to study the behavior of electronic packages and their material constituents under different mechanical/thermal loading conditions: like dynamic warpage of packages using optics-based tools (like Shadow Moire, Twyman Green Interferometry, Fizeau Interferometry, Confocal); interfacial adhesion strength using Double Cantilever Beam test; fracture toughness of bulk materials using three-point bend test; material CTE using Digital Image Correlation method; and crack (or defect) detection and classification using acoustic emission (or optical) sensors and AI/ML codes.
  • Employees also develop new metrologies and software capabilities for use with next-gen packaging technologies.

The candidate should also exhibit the following behavioral traits/skills:

  • Experimental Mechanics background, along with problem solving and programming skills.

This is an entry level position and will be compensated accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.


Minimum Qualifications

  • Possess PhD degree and 1+ years of experience in one of the following majors: Mechanical Engineering or Aerospace Engineering or Materials Science and Engineering, or related field
  • Must have the required degree or expect the required degree by December, 2022


Preferred Qualifications

1+ years of experience with one or more of the following:

  • Material characterization, load frames, DAQs, PID controllers, basic optics, 3D CAD and/or structural health monitoring.
  • LabView, Matlab/Python programming.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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