Packaging Research and Development Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

Assembly and Test Technology Development (ATTD) Chip Attach Module (CAM) Module Equipment Engineers will be expected to:

  • Provide project management design development and sustaining support for semiconductor manufacturing equipment and integrated circuit or semiconductor assembly processes
  • Be responsible for the thermal mechanical and electrical design analysis and development of electronic packages and semiconductor manufacturing equipment
  • Define overall package performance and specification and realize technology certification through layout design and test vehicle design
  • Conduct tests and research on basic materials/properties/semiconductor manufacturing and equipment technologies
  • Establish material specifications for contract assemblers and raw material vendors and interface with Quality Assurance and Purchasing regarding material quality and vendor performance
  • Establish equipment/process specifications for semiconductor equipment vendors and interface with Global Supply Chain regarding equipment quality and vendor performance
  • Provide consultation concerning semiconductor manufacturing equipment and packaging problems and improvements in the packaging equipment and process
  • Respond to customers requests or events as they occur
  • Lead cross-functional teams to Develop solutions to problems utilizing formal education and judgment


This position is not eligible for Intel immigration sponsorship if a candidate only hold's a bachelor's degree with experience.

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Minimum Qualifications

  • Possess a bachelor's degree with 6+ years of experience or master's degree with 4+ years of experience or PhD degree with 2+ years of experience in Mechanical Engineering or Material Science Engineering or Electrical Engineering or Physics or Chemistry or Optical Engineering or Polymer Science and Engineering or any other related field

Preferred Qualifications

5+ years of experience with one or more of the following:

  • Fundamental science and engineering concepts in development to create novel solutions including Statistical Process Control (SPC)/Design of Experiments (DOE) principles
  • Integrated Technical Problem Solving with Factory Equipment Assembly Material Sets and Key Process Parameters (KPP)
  • Equipment troubleshooting skills and experience that support Semiconductor Process signals
  • Developing Equipment and Process Recipe Development for Semiconductor Equipment
  • Statistical Process Control (SPC)/Design of Experiments (DOE) principles used for Technical Problem Solving
  • Sustaining Semiconductor Process Steps in dynamic Operations Environment

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer

Phoenix, AZ 85003

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