Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0179921
Job Description

Become a part of Intel's Advance Packaging Team by joining the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the SPTD organization to assist in achieving our mission and continuing to make this a great place to work.

Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development, 1274/1276/EMIB Client/Server product substrate technology development and to scale EMIB/Co-EMIB substrate packaging technology to enable further die disaggregation / heterogenous integration.

This position requires the majority of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.

Responsibilities will include but not be limited to:

- Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies
- Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials interactions
- Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity.
- Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.

The ideal candidate should exhibit the following behavioral traits and/or skills:

- Written and verbal communication and teamwork skills.
- Interact with equipment and materials suppliers.
- Willingness to travel (some travel may be required, less than 5 percent)
- Work with ambiguity and flexibility with respect to job roles and working hours is required.

This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences .

Minimum qualifications:

-Candidate must possess a PhD degree with 1+ years of experience in a relevant science or engineering field Mechanical Engineering, Chemical Engineering, Materials Science, Physics or Chemistry.

Must have the required degree or expect the required degree by December 2021. 


Preferred qualifications:

1+ years of experience in the following:

- Engineering troubleshooting and analytical skills on integrated technology issues and experience working with broad team of other process and integration engineers.
- Experience owning process tools with knowledge of SPC PCS RFCs equipment troubleshooting statistical design of experiments and process development.
- Experience working with a variety of organic/inorganic materials and processes as well as characterizations utilizing techniques such as DSC, TGA, D/TMA, Titration, ICPMS, FTIR, XPS, TOFSIMS, EDX, SEM, etc.
- Experience with statistical data analysis, JMP and JSL, Python, relational database structure and usage, machine learning.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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