Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0179220
Job Description

Become a part of Intel's Advance Packaging Team by joining the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the SPTD organization to assist in achieving our mission and continuing to make this a great place to work.

Substrate Packaging Technology Development (SPTD) Microelectronic Packaging Research and Development Engineers provide project management, package design and/or development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

The scope of this role include:

- Process equipment design, install, and qualification
- Technology pathfinding and development of surface finish module focusing on surface prep processes, electroless and electrolytic plating.
- The engineer will join / become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.

Other responsibilities include but are not limited to:


- Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies
- Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials / chemistry interactions
- Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
- Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.

The ideal candidate should exhibit the following behavioral traits:


- Proven technical leadership skills: Self initiative, leadership, action-oriented by influencing, written and verbal communication skills with the ability to work independently.
- Demonstrated ability to successfully participate in a highly matrix environment managing resources and timelines, as well as proven stakeholder management.
- Flexibility in changing priorities and responsibilities to support business needs.
- Work with ambiguity in a fast paced, constantly changing product roadmap environment.

This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum qualifications:

  • Candidate must possess a Master's degree with 6+ months of experience or PhD degree with 1+ years of experience in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, or related engineering degree.

Must have the required degree or expect the required degree by December 2021


Preferred qualifications:

  • 6+ months of experience in plating chemistry and electrochemistry fundamental knowledge.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer

Intel
Phoenix, AZ 85003

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