Packaging Research and Development Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

Microelectronic Packaging Engineers in Assembly and Test Technology Development (ATTD) will be responsible for, but are not limited to:

  • Provide project management package design development and sustaining support for integrated circuit or semiconductor assemblies various other electronic components and or completed units.
  • Responsible for Test vehicle package design used for packaging technology development.
  • Define overall package performance and specification and realizes technology certification through layout design.
  • Provide consultation concerning packaging problems and improvements in the packaging process.
  • Respond to customer client requests or events as they occur.
  • Develop solutions to problems utilizing formal education and judgment.

A successful candidate should also exhibit the following behavioral traits and work well in a diverse team environment.

  • Work with minimal supervision and adjust to rapidly changing priorities.
  • Produce quality results in a timely manner.
  • Discipline and an ability to self-motivate.
  • Analytical problem solving, testing skills and communication skills.
  • Effective use of constructive confrontation to address issues.
  • Stakeholder management.

This is an entry level position and will be compensated accordingly


Candidate's which only possess a bachelor's degree: This position is not eligible for Intel immigration sponsorship

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • Possess a bachelor's degree with 3+ months of experience or master's degree with 6+ months of experience in Electrical Engineering or Mechanical Engineering or related disciplines
  • Must have the required degree or expect the required degree by October, 2021

Preferred Qualifications

3+ months of experience with one or more of the following:

  • Package/Substrate technology development
  • Exposure with physical design Package/PCB
  • Package design tools like Auto CAD Cadence/Mentor Graphics
  • Package layout extraction and Electrical modeling/simulation tools such as PowerDC, Direct Current, Hyper lynx, Quasi Three Dimensional (Q3D) and High Frequency Structure Simulator (HFSS)
  • Scripting using languages such as Python Visual Basic (VB), C/C++ and other languages

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer

Phoenix, AZ 85003

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