Packaging Research and Development Engineer

Intel
Hillsboro, OR 97123
  • Job Code
    JR0164346
Job Description

Assembly and Test Technology Development (ATTD) Microelectronic Packaging Research and Development R&D Engineers provide On Shift sustaining support for integrated circuit or semiconductor processes project collaboration and package design and/or development process feedback.

Responsibilities will include but not be limited to:

  • Product disposition and New product recipe creation
  • Documentation of process issues and data collection using area specific methods
  • Supporting Assembly processes and/or equipment improvement applying novel concepts in Die Prep technology solutions for next generation Central Processing Units (CPUs) and devices
  • You will also be helping to develop innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies In this position you will be improving sustaining and codeveloping processes to meet quality reliability cost yield productivity and manufacturability requirements Innovating problem solving supporting development and continuously improving equipment and processes using experimental design and statistical methods
  • Provide process and equipment specification feedback applying principles for design of experiments and data analysis planning and documentation of improvements through the Best Known Method (BKM)
  • Developing solutions to problems utilizing formal education statistical knowledge and problem solving tools
  • Training production and process engineers for technology transfer to other factories worldwide for High Volume Manufacturing
  • Willingness to work compressed work week schedule to support 24/7 business operational need

The ideal candidate should exhibit the following behavioral traits:

  • Technical leadership skills
  • Self initiative leadership strategic shift planning coaching and supporting the development of a technical team
  • Willingness to successfully participate in a highly matrix environment managing resources and timelines as well as proven stakeholder management
  • Flexibility in changing priorities and responsibilities to support business needs
  • Tolerance for ambiguity in a fast paced constantly changing product roadmap environment
  • Self Initiated and action oriented by influencing communication skills with the ability to work independently

This is an entry level position and compensation will be given accordingly.


Qualifications

This position is not eligible for Intel immigration sponsorship.

You must possess the below requirements to be initially considered for this position
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.


Requirements

  • Possess a bachelor's degree and 3+ months of relevant experience in one of the following majors Mechanical Engineering or Material Engineering or Electrical Engineering or Physics related field
  • Willing to work a compressed work week schedule Shift 7: Days Backend: AM - PM Thursday, Friday, Saturday and every other Wednesday
  • Must have the required degree or expect the required degree by August, 2021

Preferred

3+ months of experience with:

  • Statistical Process Control (SPC) and/or Design of Experiments DOE principles
  • Participation and a sense of ownership frequent fabrication floor presence and interaction with manufacturing personnel
  • Technical innovation and delivered results for complex time critical technical projects
  • Semiconductor fabrication processes and technology with technical and analytical skills and problem solving techniques
  • Willingness to apply fundamental science and engineering concepts in development to create novel solutions

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Research and Development Engineer

Intel
Hillsboro, OR 97123

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