Packaging Engineer - Direct Lid Attach Module

Intel
Phoenix, AZ 85003
  • Job Code
    JR0184292
Job Description

The position is for Platform lead (PL) for Direct lid attach module in Assembly and Test Technology Development (ATTD) Engineering group.

  • The candidate defines and establishes process flow, procedures, and equipment configuration for the assembly module.
  • Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
  • Plans and conducts experiments to fully characterize the process throughout the development cycle.
  • Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel.
  • Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.
  • Establishes process control systems for the process module and sustains the module through volume ramp.
  • Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future.
  • Trains production/receiving process engineers for transfer to other factories.
  • Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines.

A successful candidate should also exhibit the following behavioral traits

  • Problem-solving, analytical, troubleshooting abilities and communication skills

This is an entry level position and compensation will be given accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • Possess a master's degree with 6+ months of experience or PhD degree with 1+ years of experience in Mechanical Engineering or Materials Science or Polymer Engineering or related field with focus on thermal engineering background or related engineering background
  • Must have the required degree or expect the required degree by December, 2021

6+ months of experience (master's) or 1+ years of experience (PhD) with one or more of the following:

  • Developing new processes through hardware/toolset development
  • Analytics and design tools in packaging industry like - AutoCAD/Solidworks/FEM analysis

Preferred Qualifications

1+ years of experience in one or more of the following:

  • Statistical data analysis software like, JMP/JSL/Python/relational database structure and usage
  • Engineering drawing and tolerancing analysis/design rules
  • Assembly (Electronic Packaging)/substrate manufacturing technologies
  • LYA/yield/Failure Analysis (FA)/electrical test/Quality and Reliability (QRE) is a plus
  • Semiconductor/silicon processing (lithography/plasma etch/plasma deposition/electroplating/associated interactions)
  • Semiconductor materials characterization techniques such as CSAM/X-RAY/XPS/TIR, SEM/EDX/TEM/TGA/DMA/Raman and other mechanical/electrical/chemical analysis techniques
  • Reliability failure modes and models in semiconductor processing/electronic packaging

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Engineer - Direct Lid Attach Module

Intel
Phoenix, AZ 85003

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