Packaging Design Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

Come and join a dynamic and challenging team within the Intel Data Platform Group (DPG) focused on engineering developing and supporting world class platforms and component building blocks aligned to DPG's roadmap and strategies. Join us in our mission to enable breakthrough innovation for cloud computing in Intel's Data Platform Engineering and Architecture group (DPEA).


As Semiconductor Package design engineer, responsibilities will include but are not limited to:  

  • Working in a team environment to develop and execute some of the world's most complex and challenging package designs across the datacenter product portfolio.
  • Leading technical aspects of the Package design and process including conducting early route studies and creation of specifications, providing electrical analysis guidance and co-design for production layout.
  • Managing design schedules, executing design layout deliverables and participating in design reviews while contributing to continuous improvements in our packaging process and design tool infrastructure.


Behavioral Traits:

  • Mentality toward adhering to correct construction practices resulting in error-free for High Volume Manufacturing.
  • Desire and passion toward collaboration and teamwork are must-have attributes as you will be working very closely with stakeholders from various organizations within the company to incorporate inputs into the package design.
  • A team player with communication and stakeholder management skills.




You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a positive factor in identifying top candidates. Requirements listed may be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Education:

The candidate must have a Bachelor of Science degree or higher in Electrical Engineering, Mechanical Engineering, or related field.

Minimum Qualifications:

     3+ years of experience with the following:

  • Physical design in Packaging and/or Printed Circuit Board.
  • Mentor Graphics Expedition Software or other Package design layout related Software (SW) suites.

Preferred qualifications: 

  • Experience in Package Substrate technology development.
  • Experience in similar design tools like Auto CAD, Allegro, Power DC or schematic based.
  • Experience in a Co-design environment.
  • Experience in Microsoft Office suite of tools.

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intels transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologiesspanning software, processors, storage, I/O, and networking solutionsthat fuel cloud, communications, enterprise, and government data centers around the world.

Other Locations

US, California, Folsom;US, California, Santa Clara;US, Oregon, Hillsboro

Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Packaging Design Engineer

Phoenix, AZ 85003

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