Packaging and Micro Integration Engineer, Intel Foundry Services (IFS)

Intel
Phoenix, AZ 85003
  • Job Code
    JR0187511
Job Description

The IFS team is looking for a passionate and driven individual to help define and build complex systems with highly integrated mechanical, electrical, thermal, vacuum and control requirements. This individual will be a member of a new project team working alongside internal/external partners to design and build new modules. The position involves both leading and supporting projects from concept definition, detailed design, process and test development, prototyping and qualification phases, through to implementation into manufacturing.
We are looking for an experienced Packaging and micro integration Engineer to join the multidisciplinary development team to support the design and development of innovative packaging solutions. You will provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, as well as various other electronic components and/or completed units. You will work to overcome conflicting volume, thermal, magnetic and other requirements and develop packaging solutions that can be integrated into larger system assemblies. Development activities include, but are not limited to:

  • Translate performance requirements into specific assembly process designs
  • Help design interconnections (writing, etc) to chips on package
  • Research and apply packaging innovations
  • Optimize manufacturability of packaging designs
  • Responsible for thermal/mechanical/electrical design, analysis and development of electronic packages.
  • Define overall package performance and specification and realize technology certification through layout design and test vehicle design.
  • Responsible to drive sourcing recommendations in alignment with various internal and external stakeholders.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:
The candidate must possess at least one of the 3 following degrees plus the years of experience determined for each degree in the areas of expertise specified below:

  • Bachelor's degree in Mechanical Engineering, Electrical Engineering, Computer Engineering or related discipline with 8+ years of experience
  • Master's degree in Mechanical Engineering, Electrical Engineering, Computer Engineering or related discipline with 5+ years of experience
  • Ph.D. in Mechanical Engineering, Electrical Engineering, Computer Engineering or related discipline with 3+ years of experience
  • 3+ years in hands on packaging and assembly experience


Preferred qualifications:

  • Proven experience as a technical lead for large and small groups in a global team environment
  • Experience leading external supplier projects
  • Expertise in design and development of packaging solutions, from concept through to volume manufacturing
  • Experience in a broad range of microelectronic technologies, materials, components, assembly and test processes
  • Experience with high vacuum

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.



Other Locations

US, California, Folsom;US, California, Santa Clara;US, Oregon, Hillsboro;Virtual US and Canada


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Annual Salary Range for jobs which could be performed in US, Colorado:
$127,330.00-$216,740.00


Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here
Intel is committed to a culture of accessibility.  Intel provides accommodations to applicants and employees with disabilities.  Find information and request accommodation here

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Packaging and Micro Integration Engineer, Intel Foundry Services (IFS)

Intel
Phoenix, AZ 85003

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