Package Mechanical Design Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0195285
Job Description

Package Engineering is a fast-paced world in Intel, and Advanced Design Technology and Solutions (ADTS) team operates at the forefront of it.

Test Vehicle and Mechanical Design Engineering is a vital organization in ADTS that richly supports the Assembly and Test Technology Development (ATTD) group in developing cutting edge technology.

This job is your career destination if you love to research and develop holistic design solutions, enjoy CAD designs, and appreciate working in a strategic role in a technical world.

  • You will have opportunities to build a rich long term successful career ranging from Test Vehicle package design, Test Chip design, Mask and Panel design, IHS design, Deign Rule development for manufacturability and assembly, Product Package Design, Test Board Design and more.
  • This role offers a unique vantage point to observe and learn the world of packaging technology development while imbibing perspectives from many technical streams.
  • It's an ideal setup for a go-getter who thrives working with various stakeholders on a day-to-day basis.
  • Opportunities to lead technical design working groups and drive design projects to fruition will manifest as soon as training completes.


Life of a Package Mechanical Design Engineer:

  • Drive Engineering requirements definition work with key internal and external industry partners to comprehend detailed design requirements.
  • Design microelectronic packaging substrates and integrated heat spreaders, stiffeners, and media components.
  • Negotiator and skilled at partnering with other groups to solve problems and drive solutions.
  • Comprehend and define manufacturing and assembly requirements to be communicated in technical engineering drawings.
  • Create 3D mechanical models and 2D technical engineering drawings for use in manufacturing, assembly, test and customer development.
  • Understand and explore the design for manufacturability and assembly constraints.
  • Share knowledge and develop new methods with peers and partners for next-generation technologies.

The candidate should also exhibit the following behavioral traits/skills:

  • Fast learner of new design applications and fundamentals from different streams of engineering.
  • Self-starter, manage and execute projects to converged deadlines
  • Communicate work status, run effective meetings and stakeholder management
  • Manage design reviews with vendors and internal stakeholders

This is an entry level position and compensation will be given accordingly.


Qualifications

For information on Intels immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information.

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • Possess a bachelor's degree with 3+ months of experience or master's degree with 6+ months of experience in an Engineering field or Mechanical or Electrical or Chemical or Industrial or relevant field.
  • Candidate must possess the degree by employment start date. 


Preferred Qualifications

3+ months of experience (bachelor's) or 6+ months of experience (master's) in one or more of the following:

  • Mechanical CAD tools - Solidworks/ProE or Siemens NX
  • Mechanical design in sheet metal components, injection molded plastic components
  • Electrical CAD Tools - Mentor Expedition or Cadence Allegro Package Design
  • Script and-or program with a track record of developing execution efficiencies through scripting and-or programming
  • Mechanics, dynamics, and heat transfer

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Package Mechanical Design Engineer

Intel
Phoenix, AZ 85003

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