OTF Failure Analysis Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0184785
Job Description

Failure Analysis Engineers in the OTF Yield Department are critical to determining root cause for yield loss and building a strong yield improvement roadmap. OTF Yield is seeking individuals with strong work ethic, diverse background, and broad experience working hands-on with analysis tools to partner with Process and Yield engineers to solve problems. In this role, the candidate will have the following responsibilities:

  • Conduct failure analysis and root cause determination on the latest technologies and products in high-volume manufacturing at Intel.
  • Generate yield improvement outcomes from the results of the analysis in partnership with Yield and Process engineering.
  • Lead and direct the analysis through various modules of the failure analysis lab - from job submission to reporting the final results and executing corrective action.

The ideal candidate should exhibit the following behavioral traits:

  • Strong work ethic, ownership and drive to achieve results and positive yield/business impact.
  • Skills to function in high-paced ambiguous environment under pressure to produce quality results quickly.
  • Skills to learn rapidly and independently - either in the field of failure analysis techniques or in collaboration with the fab process modules and integrators.
  • Skills to thrive in a diverse and highly technical team setting to solve problems.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position.  Qualifications listed as preferred or additional will be considered a plus factor for applicants.

Minimum Qualifications:

  • Candidate must possess a Bachelors degree in Electrical Engineering, Physics, Materials Science or related field of study with +7 years of related experience, a Masters degree in the previously mentioned areas with +5 years of related experience, or a Ph.D. in the previously mentioned areas.
  • 1+ years of relevant experience in:
    • Understanding and/or practical experience with semiconductor device physics and contemporary fabrication process technologies.
    • Understanding and/or practical experience with materials, surface and device characterization techniques supporting semiconductor science and manufacturing (such as SEM, TEM, EDX, SIMS, XPS, XRD, FTIR or Auger)
  • Candidate must be willing to travel for training assignments to one of Intel's manufacturing development sites.

Preferred Qualifications:

Direct experience or exposure to failure analysis lab operations and techniques such as:

  • Materials and Sample Preparation methods such as polishing, dimpling, wet/dry etches.
  • SEM, FIB, TEM, LSM (electron, ion, photon beam tools) operation and theory.
  • TEM sample preparation.
  • Fault isolation methods such as: Emission Microscopy (thermal, NIR or optical), TIVA/LIVA/OBIRCH/EBIRCH, LVP, LADA, SMI, lock-in thermography etc.
  • Lab bench or ATE testing capabilities for SoC/CPU
  • Hands-on experience with electrical device probing and characterization, particularly with atomic force or beam-based. methods after some deprocessing/delayering. This should include the ability to isolate key defective aspects of device and interconnect characteristics and convey the next steps of analysis to the team and customers.
  • Experience or background with semiconductor product EDA tools, CAD navigation, testing platforms and test plans.
  • Skills to design and code automation for lab testing/characterization using modern scripting or software development tools - such as Python, Perl/TCL, JSL, R or similar.
  • Exposure to or strong background using statistical analysis tools such as JMP, SAS, Minitab.
  • Familiarity with latest machine learning tools applied to process and device analysis to accelerate root cause determination.
  • Understanding or training in SoC or CPU microarchitecture and testing.
  • Practical or applied lab research is preferred.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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OTF Failure Analysis Engineer

Intel
Phoenix, AZ 85003

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