Oregon Assembly Technology Integration Engineer

Intel
Hillsboro, OR 97123
  • Job Code
    JR0198606
Job Description

As part of Intel's IDM2.0 strategy, we are moving forward aggressively with our IFS offerings. We need motivated and experienced engineers to enable this strategy. Oregon Assembly Technology Integration (OATI) team owns developing process technology in Bumping , Wafer level assembly and Die prep and this position is intended to support the IFS process development. The candidate is expected to:

  • Lead design rule definitions and technology offerings for IFS customers

  • Lead Task Forces and working groups to promptly solve integrated problems.

  • Manage complex projects and drive schedules.

  • Working with OSAT to transfer technology building blocks for key customers.

  • Demonstrate strong communication and presentation skills.

  • Demonstrate leadership skills and willingness to work with teams spread across different geographies and organizations in and outside Intel.

  • Role model ONE INTEL culture.


Qualifications

You must possess the below requirements to be initially considered for this position
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates

Requirements:
Candidate must possess a Masters degree with 3+ years of relevant experience in Chemical Engineering or Materials Science or Physics.

3+ years of experience in the following:

  • Familiarity with Far Back End/ Bumping Process and working experience with OSATs.

  • Rudimentary knowledge of characterization techniques such as CSAM, Xray, XPS, FTIR, SEM, EDX.

  • Model based problem solving experience .

  • Knowledge of NPI methodology DOE and statistical Process control.


Preferred qualifications:

  • 5+ years of experience in the following:

  • Focus on fundamental understanding of SI processing.

  • Process integration experience.

  • Design rule and product life cycle knowledge.

  • Program management experience.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Oregon Assembly Technology Integration Engineer

Intel
Hillsboro, OR 97123

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