Ocotillo Technology Fabrication Litho Principal Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0198692
Job Description

Fab Sort Manufacturing (FSM) is responsible for the production of all internal Intel silicon using some of the world's most advanced manufacturing processes. With fabs (short for fabrication facilities) in Israel, New Mexico, Ireland, Arizona and Oregon, FSM operates as a highly coordinated virtual factory network, supporting multiple technology nodes for all Intel products. FSM supports new product introductions (NPIs) for all new products entering the high volume fabs, evaluates performance of each product to enable supply commits and approves risk start memos (RSMs) for all products that begin Start up and ramp in FSM factories ahead of production qualification.
FSM is in the midst of an exciting time of growth, delivering output in support of Intel's run of record revenues the last few years. With the multitude of technologies expected to be in production and the complexity of ramping newer nodes with breakthrough technologies. It is important that each factory has the leadership to help steer the organization to success and collaborate across the FSM factory network.
The OTF (Ocotillo Technology Fabrication) Litho Principal Engineer will report to the OTF Litho Department Manager. Each FSM factory has around 2000+ employees and is currently responsible for all CE_ Items of the factory systems, Start up, Matching, Ramp and introducing new products and processing of advanced micro processors, with a wide variety of products including Client, Data Center and Chipsets from through the full silicon process flow. The successful candidates must be capable and interested in personally leading the factory and the people safely and all operations in high quality manner on a daily basis tactic and strategically. Hands on involvement in operations is required and with excellent teamwork.
As an OTF Litho Principal Engineer you will play an important role in the OTF engineering team. The responsibilities will include, but are not limited to:

  • Owning all aspects of one or more of the factory's yield baseline and improvement as well as driving wafer cost to competitive benchmarks.
  • Your sustaining responsibilities will include activities and ownership around the overall safety, quality, affordability, and velocity of the technologies in OTF.
  • As a senior technical leader, you will be a key contributor in setting targets with the OTF Factory Staff, devising strategies to drive world class performance, and executing those strategies throughout the organization.
  • Be a significant contributor and driver of the culture in the OTF technical community.
  • Mentor and lead the teams through detailed modeled based problem-solving methodologies to deliver required problem solving cadence for the dynamic 24x7 manufacturing environment.
  • Delivering MOR (Model of Record) availability and achieving 100 percent matching for all relevant operations.
  • For new technology start-ups, you will be responsible for tool installations, conversions, and qualifications; and sustained matching performance.
  • Drive continuous improvement in the health and matching of your toolset(s) by maintaining and driving an improvement roadmap.
  • Leading your tools and area to achieve record tool availability, cycle time, and record low defect densities in support of OTFs factory goals.
  • Position may require working on shift 1, or on a Compressed Work Week (either day or night shift) as an OSE (On-Shift Engineer) to support toolset needs.
  • OTF supports a High-Volume Manufacturing. As such, your role may include elements of module-level process development in support of the factory's goal and output.

Demonstrated results and accountability for leadership and role modelling of Intel's cultural attributes as follows:

  • Customer obsessed - Seek to understand what matters most to our customers, listening more and talking less.
  • One Intel - 'We' before 'Me'. We work across boundaries, collaborating across the aisle and around the world.
  • Fearless - We are bold. We take risks and challenge ourselves. We fail fast, iterate, and continuously improve.
  • Truth and Transparency - allows the best ideas to emerge and speeds our ability to solve problems faster.
  • Inclusion - Inclusion runs through each attribute and is integral to our culture evolution.

The ideal candidate should exhibit the following behavioral traits:

  • Working in an environment with new and frequently changing challenges.
  • Exceptional customer orientation.
  • Good communication skills with a high tolerance to ambiguous and changing situations.

Preferred Qualifications:

  • Extensive knowledge in technology transfer and ramp with emphasis in yield baseline improvement.
  • Fab engineering experience [10nm/ 14nm/ 22nm/ or 32nm generation].
  • Demonstrated Leadership and Management of technical teams
  • Working knowledge of device physics and process technology and equipment.
  • Detailed understanding of model-based problem solving as well as Fab process control systems and methodologies.
  • Background in chemical quality in relation to defect and parametric improvement.
  • Working knowledge of wafer cost optimization to meet competitive benchmarks.
  • Strong knowledge of statistics and experimental design; and have experience applying that knowledge to tool matching, tool qualification, and process development.
  • Experience working across organizational boundaries including process engineering, integration and yield.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:

  • Candidate must possess a Bachelor's, Master's, or PhD degree in one of the following: Physics, Optics, Materials Science, Electronic or Electrical Engineering, Chemistry or Chemical Engineering (PhD considered a plus).
  • Candidates should have 15 + years of 300mm Process Engineering experience in either the subfab or fab functional areas.

    Inside this Business Group

    As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


    Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



    Posting Statement

    All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.



    Position of Trust

    This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter....

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    Ocotillo Technology Fabrication Litho Principal Engineer

    Intel
    Phoenix, AZ 85003

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