Novel Memory Integration Engineer

Hillsboro, OR 97123
  • Job Code
Job Description

Components Research delivers innovative device technologies and architectures to enable Intel's roadmap. Memory R+D team is looking for Novel Memory Integration Engineers for demonstrating game-changing dense memory options, including new materials, new device structures and new process integration schemes for Intel product differentiation.

Your responsibilities include:

  • Initiate new research projects
  • Determine and develop optimal integration process flow for successful demonstration of viable technologies
  • Work with device, process module and design experts to meet performance, reliability and yield metrics
  • New inventions and patent filing
  • Presenting to conferences occasionally
  • Work with other Technology Development groups

Important behavior traits we look for:

  • Demonstrated out-of-the-box innovations, creative thinking and project vision
  • Highly motivated team player

This is an entry level position and compensation will be given accordingly.


You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Requirements:
Possess a PhD. degree in Electrical Engineering or related fields of study.

Must have the required degree or expect the required degree by September 2021.

  • 1+ years of experience in hands-on device fabrication
  • Direct experience in process characterization, metrology and troubleshooting
  • Electrical device characterization
  • Publications in leading journals or conference
  • CMOS process technology and memory device fabrication

Preferred Requirements:

  • Process variations impact on device operation
  • Ferroelectric materials and process
  • Device physics knowledge
  • Test-chip layout
  • Process yield analysis

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Novel Memory Integration Engineer

Hillsboro, OR 97123

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