NAND Product Test Development Engineer _ SK

Intel
Folsom, CA 95630
  • Job Code
    JR0185585
Job Description

This position is associated with the sale of Intel's NAND memory and storage business to SK hynix (You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf). The transaction will enhance the resources and potential of the business' storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.  

This is an exciting time to be at Intel - come join our NAND team as a Product Development Test Engineer and work on one of the most advanced 3DNAND and SSD technology portfolios in the world. 

As the global leader in the semiconductor industry, Intel possesses many industry-leading SSD technologies including the most capable Quadruple Level Cell (QLC) NAND Flash products. As a Product Development Test Engineer, you will be part of a world-class team that will transition to lead the SSD business at SK hynix.   

This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK hynix. 

This position gives a unique opportunity for the candidate to showcase leadership, hardware, software and data-analysis skills. The candidate will be part of a dynamic team and a unique work culture. This is a high impact role, with a broad scope where the candidate will have clear ownership, accountability, and the deliverables will have direct visibility and impact to overall business.

As a NAND Product Test Development Engineer the candidate will be responsible for:

Test development of next generation 3D NAND Memory Technology products.

Ensuring the testability and manufacturability of integrated circuits from feasibility stage through production ramp.

Development, evaluation, debug of complex circuits and test programs.

Development, testing, and qualification of new test hardware solutions.

Collaborating with cross-functional teams such as Test Engineering,

Design Engineering, Technology Development, Product Engineering and Process Engineering to resolve cross-functional problems.

Responsible for driving process improvements by creating tools and systems.

Responsible for driving cross-functional stakeholder consensus and providing technical leadership and mentorship for junior engineers.

Responsible for coming up with innovative solutions to drive Test Time Reduction and Yield improvement.

The ideal candidate should be a strong team player, enthusiastic about working in a collaborative, cross-functional, cross-site environment. Be self-directed, analytical, and experienced in trouble-shooting and resolving complex technical problems, And be able demonstrate strong communication, technical presentation and problem solving skills


Qualifications

The below minimum qualifications must be met to be considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • The candidate must have a Bachelors degree in Electrical Engineering, Computer Engineering or related field.
  • 3+ years of experience in the following areas:
  • -Programming (C/C++).
  • -Data extraction and analysis.
  • 1+ years working with semiconductor devices and circuits.


Preferred Qualifications:

  • 1+ years of experience in the following areas:
  • -NAND or NOR flash memory product development.
  • -Sort, class, system Test techniques.
  • -Python scripting.
  • -Git/Bitbucket/Agile methodology.
  • -Semiconductor fabrication process flow, wafer test methodologies and reliability mechanisms.
  • -Silicon debug, module development, content development, RTL simulations and Test Program Integration.
  • Masters degree in Electrical Engineering, Computer Engineering or related field.

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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NAND Product Test Development Engineer _ SK

Intel
Folsom, CA 95630

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