Microelectronics Packaging Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management package design/development and sustaining support for integrated circuit or semiconductor assemblies various other electronic components/completed units.

The candidate will be responsible for:

  • Design optical module/component/system in electronic products by closely working with optical, mechanical, thermal, and electrical engineers

  • Optimize optical system design by developing optical, thermomechanical models of optical systems

  • Design and develop test structures, DOE plans, and perform measurements to validate optical, thermomechanical models for optical system performance evaluation and reliability risk assessment

The candidate should also exhibit the following behavioral traits/skills:

  • Critical thinking in failure analysis
  • Develops concepts; demonstrates originality and ingenuity
  • Understanding of how statistics are applied to mechanics

This is an entry level position and compensation will be given accordingly.


You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • Possess a PhD degree and 1+ years of experience in Mechanical Engineering, Optical Engineering, or related disciplines

  • Candidate must possess the degree by employment start date. 

1+ years of experience in one or more of the following:

  • Performing mechanical/thermal analysis for opto-mechanical systems

  • Optical system design, fabrication, assembly, and alignment

  • Use of optical adhesives/epoxies in packaging design

  • DFM and manufacturing process development of optical components such as fibers, lens, couplers etc.

  • Optical analysis, including sequential and non-sequential analysis, using Zemax or equivalent tools

  • Solidworks (or any other 3D CAD), and Abaqus (or any other FEA software)

  • Solid Mechanics, material behavior and failure mechanisms of metal, molded glass optics, and plastic optics

  • Geometric Dimensioning and Tolerancing knowledge and reading mechanical drawings and tolerance stack up analysis

  • Root cause investigation, and DOE/FMEA creation

Preferred Qualifications

1+ years of experience in one or more of the following:

  • Root cause investigation, and DOE/FMEA creation

  • Optical passive components (e.g. waveguide, resonator, coupler) and active components (e.g. modulator, detector, laser) design and analysis using KLayout, IPKISS, Lumerical MODE/FDTD/DEVICE or equivalent

  • Optical circuit simulation using Lumerical INTERCONNECT or equivalent

  • Optical metrology equipment and optical measurements

  • MATLAB/Python, and scripting

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Microelectronics Packaging Engineer

Phoenix, AZ 85003

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