Microelectronics Packaging Engineer

Phoenix, AZ 85003
  • Job Code
Job Description

Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management package design/development and sustaining support for integrated circuit or semiconductor assemblies various other electronic components/completed units.

  • The candidate will be responsible for Influencing the architecture design materials selection and structural integrity of high performance Integrated Circuit (IC) packages and other associated components and collaterals under manufacturing test and usage conditions.
  • Focus on linear and nonlinear response analysis and testing of microelectronic packages devices and enabling components.
  • The candidate will be expected to identify assess and/or develop key analytical techniques.
  • As part of the job function candidate will also be expected to interact with other engineers to define and execute validation experiments as part of technology and process development.

This is an entry level position and compensation will be given accordingly.


You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

  • Possess a PhD degree and 1+ years of experience in Mechanical Engineering Applied Mechanics or related disciplines
  • Must have the required degree or expect the required degree by December, 2021.

1+ years of experience in one or more of the following:

  • Solid Mechanics
  • Static and dynamic analyses
  • Metals and polymeric material behavior and failure mechanisms
  • Linear and nonlinear finite element methods
  • Commercial finite element and computational software

Preferred Qualifications

1+ years of experience in one or more of the following:

  • Integrated Circuit (IC)
  • Packaging and Printed Circuit Board (PCB) technologies
  • Mechanical Design and Experimental methods

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Microelectronics Packaging Engineer

Phoenix, AZ 85003

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