Metrology and Defect Inspection TD Process Engineer

Intel
Albuquerque, NM 87102
  • Job Code
    JR0200708
Job Description

Intel 3D XPoint is a new breakthrough in Non-Volatile Memory (NVM) technology and is revolutionizing the NVM landscape and storage/memory as we know it. This is one of the key pillars for Non-Volatile Memory Solutions Group (NSG) growth and is a critical element of Intel's overall connected platform strategy.

We are looking for Technology Development Engineers in Metrology and Defect Inspection area.

The ideal successful candidate will:

  • Demonstrate an in-depth knowledge of Metrology techniques such as Scatterometry, Ellipsometry, XRR, XRF and XRD.
  • Willing to pair tool capabilities with current yield issues to ensure adequate inline detection/learning.
  • Improve Inline detection of yield issues using innovative techniques Partner with vendors and equipment engineers to drive future tools to meet upcoming needs.
  • Define the roadmaps to meet requirements, goals, and milestones for a new technology process.
  • Establish process controls and reaction mechanisms to protect the fab from excursion events.
  • Strive to achieve and deliver leading edge process capability, yield, cost, and manufacturability. This will involve exceptional collaboration with cross-functional/cross-company teams and tool vendors to meet challenging program goals.
  • Define and establish flow, procedures, and equipment configuration.

The ideal candidate will exhibit the following behavioral skills: :

  • Demonstrate experience with technical problem-solving skills, and with multitasking.
  • Be a fast learner, willing to adapt to the culture and the technology.
  • Be flexible in accommodating changing priorities and working hours to support business needs.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. 

Minimum Qualifications:

The candidate must have a Masters or PhD degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Material Science, Physics, or Chemistry.

5+ years of experience in the following areas:

  • Semiconductor FAB processing
  • Statistical Process Control SPC or Design of Experiments DOE principles
  • Semiconductor process development

Preferred Qualifications:

5+ years of experience in the following areas:

  • Volatile and/or non-volatile memory
  • Metrology and defect inspection techniques

Inside this Business Group

The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intels transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologiesspanning software, processors, storage, I/O, and networking solutionsthat fuel cloud, communications, enterprise, and government data centers around the world.


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Metrology and Defect Inspection TD Process Engineer

Intel
Albuquerque, NM 87102

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