Manufacturing Engineer

Intel
Hillsboro, OR 97123
  • Job Code
    JR0186903
Job Description

The Manufacturing Engineering Technologist is a key member of our Manufacturing, Test, and Engineering Operations (MTE) team within Client Platform Engineering (CPE), supporting board and system platform development. You will be supporting our internal and external client reference designs across all swimlanes including our most Advanced Engineering Platforms (AEP). Manufacturing Engineering Technologist will be critical in helping set and drive direction for CCG requiring sound decision making at both tactical and strategic levels, regularly evaluating the quality of the design and manufacturing process to ensure a robust technology is developed to meet varied customer needs.

In this position, you will be responsible for driving early engagement with our client engineering and architecture teams, partnering with our ATTD (Assembly Test Technology Development)/CPTD (Customer Platform Technology Development) on new client packages and manufacturing process development, supporting new manufacturing and PCB technologies to internal and external customers including ensuring quality and reliability requirements are understood and being met.


You will be responsible for supporting reference platform development by driving Design for Manufacturing (DFM) requirements into the platform and ensuring Surface Mount Technology (SMT) manufacturing qualification of new client chipsets, SoC packages, and other non-intel components and technologies in the next generation client boards and systems. We are seeking an individual with a strong background in Printed Circuit Board Assembly (PCBA)/SMT manufacturing) to help influence next generation client boards and assembly.

A successful candidate must demonstrate:

  • Problem Solving skills.

  • Written/verbal communication skills working directly with customers.

  • Self-directed work ethic and a can-do attitude; will work within a team environment facing fast changing requirements, formidable challenges and stakeholders with diverse expectations.

  • Team building proficiency with the ability to work well in a global team environment

  • Motivated self-starter who can work with minimal supervision in a collaborative but frequently ambiguous environment.

  • A track record of solving complex problems using structure problem solving methodologies.

  • Demonstrated strength in technical and analytical problem solving

  • Ability to extend influence and work across multiple functional roles, in different geographies, with internal and external stakeholders to develop and implement solutions

  • Critical performance skills that include self-initiative, clear and crisp communication, ability to work well with a diverse range of backgrounds, and effective time management

  • Experience as a technical program manager or program management in an associated field

  • Willing to make technical decisions and provide technical direction

Your responsibilities will include but not be limited to:

  • Establishing solder joint quality risk assessments for all board level component technologies (surface mount), including determining quality requirements to achieve company and customer objectives.

  • Providing technical inputs on the design of board, component, and package assembly test vehicles.

  • Enabling new and innovative capabilities/technologies across the client division and our Outsource Design Manufacturers (ODM)/Contract Manufacturer (CM) Network.

  • Collaborating with external customers to develop strategies to assess SJQ risk in ODM manufacturing environments.

  • Working directly with external customers to introduce next generation PCB and board assembly technologies.

  • Developing and executing manufacturing technology certification strategies and plans as it relates to client platforms.

  • Designing and executing experiments to identify quality failure mechanisms.

  • Extraction and statistical analysis of SJQ data to enable prediction of field quality performance.

  • Communicating solder joint quality results, risks, and recommendations.

  • Collaborating with our client design teams, manufacturing sites, ATTD/CPTD and mechanical core component teams for achieving required levels of product solder joint quality.

  • Developing improved manufacturing methods and business processes based on structured methods (including Lean, Six Sigma, and other methods).


Qualifications

You must possess the education and minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Minimum Requirements

Bachelor of Science degree in Mechanical Engineering, Materials Science, Industrial Engineering, Electrical Engineering, or applicable related engineering field AND

  • 5+ years of experience in Surface Mount Technology (SMT) Manufacturing Engineering environment

  • 2+ years of experience in Technical Program Management in Manufacturing Engineering or Quality & Reliability.

  • 2+ years of experience in different soldering metallurgies used in Printed Circuit Board Assembly (PCBA)

Preferred Qualifications:

  • Knowledge of solder joint quality failure modes/mechanisms

  • Understanding of different Soldering process metallurgy and materials in PCBA assembly

  • Demonstrated strength in technical and analytical problem solving

  • Experience in data collection and statistical data analysis, especially quality statistics, and statistical process control

  • Knowledge of design of experiments, measurement capability analysis, and screening experiments

  • Familiarity with semiconductor packaging assembly and package and socket failure modes and mechanisms

Inside this Business Group

The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to continue to advance PC experiences to deliver the real-world performance people demand. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth.



Other Locations

US, Arizona, Phoenix;US, California, Folsom;US, California, Santa Clara


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Manufacturing Engineer

Intel
Hillsboro, OR 97123

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