26 days old

Hardware Engineering Asc Mgr

Lockheed Martin
Moorestown, NJ
  • Job Code
At Lockheed Martin Rotary and Mission Systems, we are driven by innovation and integrity. We believe that by applying the highest standards of business ethics and visionary thinking, everything is within our reach – and yours as a Lockheed Martin employee. Lockheed Martin values your skills, training and education. Come and experience your future!

This position is for manager of the Advanced Electronics Packaging and Analysis Group which is part of the Mechanical Design & Hardware Engineering Prototype Services Department reporting directly to the department Senior Manager. This manager will provide technical, programmatic and administrative leadership to a group of approximately 10 engineers of varying experience levels. The manager will be responsible for ensure successful implementation of hardware requirements into designs for multiple programs; coordination with programs, Manufacturing and SMEs on development of designs and manufacturing efforts; recommendations, planning and execution of IRAD efforts; supporting business pursuits and proposals; and developing key expertise needed to grow the business in this area. The manager will oversee the design, development, documentation, and testing of radar hardware in the electronics packaging and microwave packaging areas. The manager will lead and ensure that the appropriate standards, processes, procedures are followed throughout the hardware development life cycle. The manager will be responsible for coordinating subordinate employee recruitment, training, performance assessment, work assignments, staffing, salary, recognition and disciplinary actions

Basic Qualifications
- Bachelor degree in Mechanical Engineering or related field
- Expertise in electronics packaging design of multi and/or single chip packages using chip and wire, flip chip and/or other high-density interconnect methods with a minimum of 6 years of relevant professional experience.
- Experience or knowledge of advanced packaging technologies such as heterogenous packaging / 2.5D / 3D and chip scale packaging for digital broadband sensors and advanced manufacturing techniques such as additive manufacturing for electronics, direct write printed electronics is highly desirable.
- Knowledge of commercial manufacturing assembly techniques and ruggedization methods for military applications.
- Demonstrated competence in leading cross disciplinary engineering teams and must have a strong understanding of hardware engineering processes and the hardware engineering product life cycle.
- Demonstrated proficiencies in earned value, schedule, cost and risk management techniques
- Occasional travel is required, must be willing to travel.
- Ability to obtain and maintain a Secret Clearance

Desired skills
- MSME is desireable
- Excellent organizational skills, interpersonal skills and be able to communicate at both programmatic and technical levels with subordinates, senior management levels and the customer

As a leading technology innovation company, Lockheed Martin’s vast team works with partners around the world to bring proven performance to our customers’ toughest challenges. Lockheed Martin has employees based in many states throughout the U.S., and Internationally, with business locations in many nations and territories

Join us at Lockheed Martin, where we’re engineering a better tomorrow

Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status

Job Location(s): Moorestown New Jersey

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Hardware Engineering Asc Mgr

Lockheed Martin
Moorestown, NJ

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Lockheed Martin
Moorestown, NJ

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