Failure Analysis Technician

Hillsboro, OR 97123
  • Job Code
Job Description

The Failure Analysis Technician will be responsible for, but not limited to:

  • Evaluating the mechanical, chemical, material characteristics of Silicon die to wafer level assembly process across the modules in a HVM (High Volume Manufacturing) environment to provide data towards the root cause of failure.
  • Using all standard failure analysis lab equipment such as SEM (Scanning Electron Microscope, FTIR (Fourier Transform Infrared Spectroscopy), FIB (Focused Ion Beam), Cross-sectioning as to perform material characterization and failure analysis.
  • Supporting new product transfer and startup, and the automation and improvement of the failure analysis process.
  • Striving to proliferate shared learning across sites.
  • Maintaining necessary records and reports, with respect to lab equipment and safety related activities.
  • Performing other related duties as required or as directed.

The ideal candidate should exhibit the following behavioral traits:

  • Attention to detail.
  • Communication.
  • Execute based on the instructions.


You must possess the below minimum qualifications to be initially considered for this position. Qualifications listed as preferred or additional will be considered a plus factor for applicants.

This position is not eligible for Intel immigration sponsorship.

Minimum Qualifications:

  • Candidate must possess one of the following:
    • Certification, Associate's degree, or Bachelor's degree in electronics, semiconductors, physics, or STEM related field of study.
    • 1+ year(s) of hands-on experience in analytical equipment (optical & acoustic microscopy), SEM, FIB, 2D/3D x-ray, mechanical polishers, or ion mill.
    • 1+ year(s) of experience in die to wafer assembly & packaging assembly processes along with exposure to associated failure modes, mechanisms.
  • Candidate must be willing to work in compressed work week or night shift as the business need arises.

Preferred Qualifications:

  • 2+ years of hands-on experience in analytical equipment (optical & acoustic microscopy, SEM, FIB, 2D/3D x-ray, mechanical polishers, ion mill.
  • Knowledge of Silicon die to wafer assembly & packaging processes along with associated failure modes and mechanisms. In addition, technical knowledge of Silicon far backend process technologies are very helpful in this role.
  • Experience in a fast-paced HVM environment handling multiple requests concurrently.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Failure Analysis Technician

Hillsboro, OR 97123

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