Failure Analysis RND Engineer

Hillsboro, OR 97123
  • Job Code
Job Description

As the Failure Analysis RND Engineer, you will be responsible for but not limited to: 

  • Identifying failures and researching process/product improvements to enhance yield, performance, quality and reliability of next generation Si, Product and Package technologies.
  • Investigates and thoroughly explains fundamental aspects of material/device interactions.
  • Owns the development of electrical, analytical and mechanical methodologies to ensure strategic failure analysis capabilities for future technologies and products.
  • Directs new technology/product transfer, manufacturing startup, and the automation and improvement of the failure analysis process.
  • Owns proliferation of shared learning across sites.
  • Maintains necessary records and reports and performs other related duties as required or as directed.


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.

 Minimum Qualifications:

The candidate must possess at least one of the following degree(s) plus the years of experience determined for each of the areas specified below. 

  • Bachelor or Master of Science degree in Physics, Electrical Engineering or a related field of study
  • 1+ year(s) of experience with at least one of the following:
    • Device physics, digital/analog circuit or Design For Testing (DFT)


  • Semiconductor fabrication, test and/or assembly packaging processing and associated materials.

Preferred qualifications:

  • Functional testers and thermal and laser optical probing experience.
  • 1+ year hands-on experience with lab equipment, including microscopy tools, such as SEM, TEM, Atomic Force Microscope (AFM), nano-prober, oscilloscopes, or semiconductor parameter analyzers.
  • Semiconductor device fabrication and characterization knowledge and experience.

Inside this Business Group

Manufacturing and Product Engineering (MPE) is responsible for test development across product segments, supporting 95% of Intel's revenue. We deliver comprehensive pre-production test suites and component/physical debug capabilities to enable high quality, high volume manufacturing.

Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Failure Analysis RND Engineer

Hillsboro, OR 97123

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