Failure analysis R&D engineer

Intel
Hillsboro, OR 97123
  • Job Code
    JR0188672
Job Description

Intel leads the semiconductor industry by creating innovative technologies. We have a passion for leading the industry and changing the world. 

The Failure analysis R&D engineer will be responsible but not limited to:

  • Performing world-class transmission electron microscopy (TEM) analysis or providing microscopy solutions for critical problems in support of process development, pathfinding, and failure analysis. 
  • Requires use of all TEM-related imaging and analysis techniques and development of novel metrology/analytical techniques to characterize the process or solve process problem that is critical to enhancing performance, yield, and reliability. 
  • Work closely with the process, yield, and equipment engineers for the design of experiments and results to identify and solve problems.
  • Partner with other TEM and analytical lab engineers to discuss experimental results, share knowledge and learning, continuously learn, develop and innovate.
  • Work closely with TEM sample preparation artists to understand and meet requirements and challenges. 
  • May support process transfer, tool maintenance, and evaluation. 
  • Maintains necessary records and reports. 
  • Performs other related duties as required or as directed.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. The experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. 

 

 Minimum Qualifications

  • The candidate must possess a Master or Ph.D. degree in Materials Science, Chemistry, Chemical Engineering, Physics or a related field.

  • 3+ years of experience in transmission Electron Microscopy (TEM) techniques.

 

 Preferred Qualifications

  • Hands-on experience of physical TEM sample preparation techniques including using dual-beam FIB lift-out technique.
  • Experience in programming and simulation of electron microscopy results or data analysis and image processing.
  • Experience with the relationship between microstructure and properties of materials.
  • Experience with device physics, failure analysis techniques, and reliability failure mechanisms.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Failure analysis R&D engineer

Intel
Hillsboro, OR 97123

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