Fab9 Wafer Level Assembly/Die Preparation Group Leader

Intel
Albuquerque, NM 87102
  • Job Code
    JR0195640
Job Description

Join the New Mexico Disaggregated Manufacturing Organization (NM DMO) amid an exciting period of transformation for the Rio Rancho, NM site during start-up and ramp of Foveros advanced 3D packaging technology.

The Wafer Level Assembly/Die Preparation (WLA/DP) Group Leader (GL) will begin with a 6-month seed assignment in Oregon learning fundamentals of WLA/DP tools and all aspects of tool installation and qualification activities. Upon returning to New Mexico, the successful candidate will manage all install/qual activities for WLA/DP until Factory Certification is achieved. This individual will work with in an integrated team of module Area Coordinators, Module Engineers, Facilities Construction Enterprise (FCE), and multiple support teams responsible for scope integration and change control, project planning, schedule integration with basebuild/progressive build scope, refinement of tool install processes and procedures, managing of program execution strategies, and tool negative float resolution. Upon factory certification, this role will transition into a module GL responsible for leading a team of 10-15 process engineers through technology ramp and into a world-class high-volume manufacturing (HVM) organization.

This position will require extensive technical experience in tool install and project management, module process engineering including but not limited to performing the following:

  • Weekly scope change and integration planning throughout the project teams
  • Identify and publish tool negative float indicators, critical gaps, and resolution plans
  • Work with the project team owners to review/revise the tool install process/procedures to improve efficiencies, documentation, and training
  • Manage Reference Package (RP) planning
  • Utilize, understand, and manage organizational systems and applications
  • Influence resource alignment to project deliverables across organizational boundaries at the factory level.
  • Monitor schedule / Identify and mitigate technical and schedule risks
  • Leverage managerial and technical skills to vigorously meet program deliverables on behalf of the area and the factory and anticipate future needs
  • Set priorities for the team, get results across boundaries, ensure an inclusive work environment, develop employees, and manage performance.
  • Plan, provide resources for and direct activities in engineering function to meet schedules, standards, area improvements and cost.


The role requires demonstrated experience and/or knowledge of all the aspects of Tool Install planning and execution, as well as project management, team leadership, and project integration. The successful candidate will be able to showcase the following:

  • Tool Install project knowledge and experience - safety, scope, schedule, and budget
  • Semi-conductor building construction, tool install sequencing, and the required integration
  • Strong analytical, project management and business partnering/influencing skills
  • Results-oriented and capable of synthesizing and abstracting complex information into clear conclusions and recommended action plans
  • Strong business and technical acumen, disciplined process management, problem solving skills, multitasking ability and attention to quality and detail
  • Detail orientation with the ability to identify the data required, analyze and interpret data, and communicate the results
  • Strong self-initiative and persistence, ability to deal with a high degree of ambiguity and drive clarity in key areas
  • Ability to interact and communicate effectively with upper management
  • Excellent written and oral communications skills with the ability to summarize key data into a concise message and communicate through presentation


Qualifications

Minimum Qualifications

  • Bachelor's degree in an Engineering discipline or related technical field with 6+ years of semiconductor industry experience, OR Master's degree in an Engineering discipline with 4+ years of semiconductor industry experience.

  • 5+ years of experience in construction or project management.


Preferred Qualifications

  • 3+ years of experience either as a people manager or as formal leader of team(s) with five or more people responsible for technical deliverables.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Fab9 Wafer Level Assembly/Die Preparation Group Leader

Intel
Albuquerque, NM 87102

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