Engineering Fellow - Circuit Card and Component Design

RTN 2 (Raytheon IDMS)
Tucson, AZ 85701
About Us:

At Raytheon Missiles & Defense, you have the opportunity to try new things and make a bigger difference across a broader end-to-end solution, a richer technology and product set, an expanded range of disciplines, a growing global footprint and a more diverse team of colleagues and customers.

Job Summary:

The Electrical Products team at Raytheon Missiles & Defense in Tucson, Arizona is seeking a Circuit Card and Component Design and Analysis Engineering Fellow that is responsible for supporting the design, manufacture, and failure analysis of advanced electrical subsystems in support of new product development, legacy re-spins, and production hardware. The selected candidate will lead teams in defining circuit card design solutions, being responsible for performance and cost, and supporting these products through their development, implementation, verification, and maintenance. They will be responsible for shaping circuit card and component development strategy for RMD, including road maps for Product Lines and new manufacturing related technologies. The candidate shall demonstrate expertise in all of the components that are necessary for developing a circuit card assembly including experience in how these systems interact with the overall guidance unit. These include but are not limited to expertise in structural design/analysis, system survivability in extreme environments, mechanical interactions and design, and system performance modeling.

The chosen candidate will be required to effectively interact with engineers across multiple disciplines including systems, mechanical, component, design for excellence, manufacturing engineering, material engineering, system test, and system verification. They will be expected to effectively present their work in program and Business Unit reviews and to provide expert counseling and mentoring, as well as, lead teams and provide technical oversight and task delegation as appropriate. The customers of this position will include internal personnel and programs, as well as external Government(s) personnel and programs. The selected team member will work with the customer and engineering leadership to define design requirements to validate and to verify that hardware being designed is compliant with requirements. They will also be required to interact with suppliers, often needing to visit supplier facilities to review and diagnose production, assembly, and development issues and provide technical solutions.

In this position, the selected candidate must have exhibited a proven track record with national recognition of circuit card assembly and component engineering knowledge as it pertains to developing products and working across a products life cycle. They will encompass a history of design innovation validated by patents and technical papers, serving as the expert through integration and qualification of electrical subsystems, and leading Failure Investigation Teams in resolution to complex production sustainment issues or electronics anomalies.

Responsibilities to Anticipate:
  • Lead selection of circuit card and component design solutions for Raytheon Missiles & Defense.
  • Lead trade studies on various electrical subsystems.
  • Lead development of requirements in support of circuit card and component environmental survivability and the requirement flow to components.
  • Drive the development, implementation, verification and maintenance of component and circuit card design in close collaboration with other disciplines to provide a mature optimized missile product
  • Identify strategic manufacturing and engineering development opportunities for Circuit Cards and Components
  • Propose and lead independent research and development (IRAD) projects for the advancement of circuit card assembly and component engineering solutions
  • Ensure balance of risk, performance, and cost.
  • Be accountable to leadership for technical decisions.
  • Participate in major technical review boards
  • Communicate and collaborate with Program Management and Technical Leadership, Engineering Leadership, Manufacturing, Suppliers, and Customers.
  • Guide, apprentice, mentor, and train colleagues within the component, PCB, and CCA development design area

An advanced degree in a related field may be substituted for an additional two years of experience.

Qualifications You Must Have:
  • Bachelors Degree in Engineering Electrical, Mechanical, Chemical Engineering, Material Science, Mathematics or other related disciplines.
  • A minimum of 12 years of directly related experience
  • Experience in interconnect technology BGAs, microvias, flex, rigid flex, embedded passives, wirebond, chip scale packaging, embedded coins, or connector technologies
  • Experience with manufacturability and performance of PCBs/Materials High Tg FR4, copper foils, Ceramic Filled Teflons, PPO laminates, mixed materials, CTE effects, reliability interactions, via reliability, pad cratering, and/or embedded passive elements
  • Experience with the impact of design choices on manufacturing costs Cost modeling, process knowledge, quality costs, assembly cost drivers, fabrication cost drivers, manufacturing capacity ramps, and process improvements
  • Experience with Silicon/Packaging BGA pattern optimization, package venting, fan-in/fan-out packaging, stacked modules, silicon interposers, embedded die, package and silicon integration, reliability, manufacturing care-abouts, CTE concerns, or thermal management
  • Experience in Layout/Signal Integrity for circuit card design and component interaction Constraint management, layout optimization, impedance modeling, optimized I/O placement, and optimal PWB stack-up
  • Experience in Supplier Development and Assessments - Supplier qualification, selection, quality systems, audits, strategic sourcing, and roadmap alignment
  • Recent experience leading technical teams

Qualifications We Value:
  • Experience in leadership and or senior engineering roles
  • Experience within the aerospace industry
  • Demonstrated ability to influence others to achieve technical and programmatic goals
  • Demonstrated proactive problem solving experience
  • Demonstrated ability to develop a business strategic vision and execute changes
  • Demonstrated ability to write successful technical proposal volumes
  • Demonstrated written and verbal communication ability to leadership

What We Offer:
Whether youre just starting out on your career journey or are an experienced professional, we offer a robust total rewards package that goes above and beyond with compensation; healthcare, wellness, retirement and work/life benefits; career development and recognition programs. Some of the superior benefits we offer include parental (including paternal) leave, flexible work schedules, achievement awards, educational assistance and child/adult backup care.

Clearance Information: This position requires the eligibility to obtain a security clearance. Non-US citizens may not be eligible to obtain a security clearance. The Defense Industrial Security Clearance Office (DISCO), an agency of the Department of Defense, handles and adjudicates the security clearance process. More information about Security Clearances can be found on the US Department of State government website here:


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Engineering Fellow - Circuit Card and Component Design

RTN 2 (Raytheon IDMS)
Tucson, AZ 85701

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