Chemical Mechanical Planarization Process Development Engineer

Intel
Hillsboro, OR 97123
  • Job Code
    JR0183474
Job Description

Intel's Logic Technology Development (LTD) has a rich history of developing advanced silicon process technologies in pursuit of Moore's Law. Over the years due to advances in Intel's design and fabrication process, LTD has continued to make devices that have pushed the boundaries of power, area and performance. One of the key steps in the fabrication process, Chemical Mechanical Planarization (CMP), has emerged as an enabler for some of the new and advanced process technologies involving key Intel innovations including novel CMP processes for the first metal-gate, FinFET, and Foveros 3D packaging technologies. CMP area is comprised of multiple polish modules focused on planarizing a variety of materials including dielectrics, semimetals, metals and organic films deposited on complex material stacks across various Intel process technology nodes. The scope of CMP group spans from novel Pathfinding to process technology development and leading up to volume ramp/ high volume manufacturing through continuous improvement in process from optimization and big data analysis, all while ensuring process technology meets specified design requirements. In this team, you will have the opportunity to design, develop and transfer unique and novel planarization process technologies to Intel's high-volume manufacturing fabs around the world and shape the future of next generation computing devices.

Responsibilities in this role include:

  • Designing, performing and analyzing experiments to develop process and meet technology requirements

  • Collaborating with various internal and external stakeholders on a variety of project issues that may require coordination across multiple functional areas.

  • Developing equipment to enhance functionality and improve the process (in collaboration with equipment suppliers), driving equipment supplier to identify shortcomings, proposing, and evaluating hardware modification to resolve issues.

  • Partnering with Global Supply Chain (GSC) and external vendors to develop consumables, hardware, metrology, operational methodology, and automation systems to meet challenging program goals

  • Participating in the development of intellectual property.


Candidates should possess the below behavioral traits:

  • Demonstrated experience with independent problem statement generation and rapid analysis of complex problems to identify a solution path.

  • Communication skills and demonstrated ability to summarize complex data sets for technical and nontechnical audiences

  • Ability to be self-directing, show initiative and work with diverse teams in a dynamic environment.

  • Flexible in accommodating changing priorities and scope to meet business needs.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.


Minimum Requirements:

  • Candidate must have a Master's (with a minimum of 6 years of experience in the semiconductor industry or related industries) or a Ph.D. degree (with a minimum of 4 year of experience in the semiconductor industry or related industries) in Electrical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering

Preferred Requirements:

  • Minimum of 1 year of experience in one or more of the following:
    • Semiconductor processing, device physics, and electrical characterization techniques.
    • Research experience with advanced transistor device structures and architectures including fabrication (e.g., lithography, etch, film deposition, cleans, chemical-mechanical planarization, etc.)
    • Expertise on characterizing the electrical performance of leading-edge transistor devices including current-voltage, capacitance-voltage, high frequency characterization (ft, fmax), gate delay, etc. and performing device and circuit simulation to confirm analysis.
    • Knowledge of future transistor device physics and process integration.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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Chemical Mechanical Planarization Process Development Engineer

Intel
Hillsboro, OR 97123

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