3D-IC STCO SOC/Physical Design Architect

Hillsboro, OR 97123
  • Job Code
Job Description

The Design Technology Pathfinding (DTP) organization in Design Enabling (DE) is chartered to identify and drive key strategic initiatives in the pathfinding as a holistic co-optimization across the Product Stack from System architecture to silicon as we extend Design Technology Co-Optimization (DTCO) to System Technology Co-Optimization (STCO). The job requires partnering and leveraging domain experts across Intel's Eco-System.

Your responsibilities may include, but not be limited to:

  • Development of 3D-IC construction and validation methodology. Evaluation and feedback of 3D-IC TFM and EDA capabilities
  • Establish Test Cases for 3D-IC STCO representing internal and external products
  • Test Chips validation of 3D-IC technology and methodology
  • Design analysis and feedback for 3D silicon and packaging technologies development
  • Collaboration with the different Product teams to identify critical product characteristics and target setting requirements.
  • Circuit Design analysis and design optimization of 3D advanced silicon/package technology features to enable strong product differentiation

Important behavior attributes:

  • Analytical and problem-solving skills
  • Verbal/written communication skills
  • Effective team player with continuous learning mindset
  • Experience working with cross functional and cross site teams


Minimum Qualifications

Bachelor's in Electrical, Computer Engineering with 4+ years of work experience OR Master's in Electrical, Computer Engineering with 3+ years of work experience

Direct hands-on experience in the following areas:

  • IP/Chip Physical design optimization and methodologies for optimal Performance Power Area Cost (PPAC)
  • Experience driving Physical Design EDA tools, design reference/sign-off flows in advanced technologies and EDA vendor engagement
  • Low-power design and Multiple clock domain design
  • Scripting skills using a programming language such as Python, TCL

Preferred requirements

  • Reference design and TFM for STCO/3DIC
  • Power Management Design Methodology and Validation Power Distribution Network (PDN), IR/EM, Thermals
  • 3D Silicon and 3D packaging technologies
  • Experience with ARM-based IP PPA optimization
  • Design for Test (DFT) and Design for Debug (DFD)
  • Product design co-optimization and productization across market segments
  • Logic design using System Verilog
  • Standard Cell Library and Memory Architectures
  • Circuit design and silicon technology.
  • Exposure to design challenges in advanced technologies

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.

Other Locations

US, California, Santa Clara

Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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3D-IC STCO SOC/Physical Design Architect

Hillsboro, OR 97123

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