3D/Advanced Packaging Supply Chain R and D Engineer

Intel
Phoenix, AZ 85003
  • Job Code
    JR0196430
Job Description

The engineer's role will involve identifying opportunities to insert existing and/or novel equipment/materials to drive enabling applications in these research programs and partnering with stakeholders to define the value proposition and drive the evaluation to meet future needs.

As the Supply Chain R and D Engineer, you will be responsible for but not limited to: 

  

  • Developing enabling materials/equipment supply chain solutions to various 3D Integration and Advanced Packaging developmental needs on leading-edge technologies for research and pathfinding programs.
  • As a Supply Chain Research and Development Engineer you will be responsible for developing enabling materials/equipment supply chain solutions to various 3D Integration and Advanced Packaging developmental needs on leading-edge technologies for research and pathfinding programs.
  • Complex materials and equipment supply chain development and integration of these actions to enable Intel's long-term research roadmap.
  • Extensive interaction and coordination with Components Research, TD, niche suppliers as well as traditional suppliers. In particular, the connection and collaboration with the TD facing GSEM Materials and Equipment groups are critical to synchronize supplier messaging and priority setting.
  • IP value return approaches for Intel will be part of the internal/external strategy development expectation to optimize materials and equipment plans in advance of our competitors.
  • Work together with partners to define the equipment configuration/performance requirements/ materials and overall materials manufacturing process flow to meet performance, quality, reliability, cost, yield, and manufacturability requirements.
  • Develops plans and strategies to validate the critical process window at the supplier.
  • Drive supplier process window validation activities on critical process modules throughout stages of development.
  • Develop solutions to problems utilizing formal technical expertise, statistical knowledge, and problem-solving tools.
  • Develop a strategy to resolve a wide range of difficult and complex problems.
  • Establish master Gantt, performs regular review on the project progress, and can successfully manage projects from concept to closure.
  • Explore and benchmarks emerging technology in the research/consortium/university space and should translate them into internal opportunities for evaluation.
  • Integrated process flows, challenges, and future directions.
  • Identify opportunities to introduce novel equipment and materials capability.
  • Develop and implement strategic engagement plans for an advanced technical capability that accounts for the interplays of multiple supplier needs into a comprehensive plan is a must.

The ideal candidate should exhibit the following behavioral traits:

  • Demonstrated analytical/problem-solving, with results orientation skills.
  • Teamwork across multiple internal teams to protect IP.
  • Interacts with and influences senior Intel and/or supplier management.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  

  • The candidate must possess a Bachelor's Degree in Engineering. Science or related field of study.
  • 5+ years of work experience in the following areas:
    • 3D integration or advanced packaging process integration or process engineering.
    • Overall semi-industry enabling programs.
    • Effective assessment of technology and business tradeoffs.
    • Stakeholder management, change management, and program/project management.

This position is not eligible for Intel immigration sponsorship.

Preferred Qualifications:

  • A Master's or a Ph.D. in Engineering or Science discipline with work experience is desired
  • Business understanding, particularly related to semi equipment and materials industry.
  • Technical expertise of Intel's and Industry's process technology, roadmap and associated challenges and needs for Equipment and Materials development.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.



Other Locations

US, Oregon, Hillsboro


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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3D/Advanced Packaging Supply Chain R and D Engineer

Intel
Phoenix, AZ 85003

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